Resin compositions

ABSTRACT

The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of the filing date of U.S.patent application Ser. No. 15/601,880 filed May 22, 2017, and claimsthe benefit of the filing date of U.S. Provisional Patent Application62/435,369 filed Dec. 16, 2016, the disclosure of which is herebyincorporated by reference herein in its entirety.

FIELD OF THE DISCLOSURE

The present disclosure is directed to thermosetting resin compositionsthat are useful for the next-generation wireless standard (i.e. namely5th generation mobile networks or “5G”).

BACKGROUND OF THE DISCLOSURE

5G is the follow-up to the current wireless standard known as 4G or longterm evolution (LTE). It is believed to be able to enable datatransmission rates of more than 10 Gbps or 100 times the throughput ofLTE. Basically, 5G technology consists of three separateelements—enhanced mobile broadband (1,000 times more capacity andone-tenth the latency), the Internet of Things (IOT) and other Wi-Fibased technology, and machine-to-machine (M2M) type communications.

Today's LTE networks (servers, router base station, etc.) are believedto operate from 700 MHz to 3.5 GHz. In comparison, 5G will not onlyco-exist with LTE, but will also operate in unlicensed or millimeterwave bands. This involves the spectrum band between 30 GHz and 300 GHz,which in turn enables more data capabilities.

Proposed next-generation technologies (5G) have higher performancerequirements that cannot be achieved with many of the compositematerials currently used in device production. The higher signalintensities required for 5G technologies will demand new compositematerials that can maintain signal integrity (e.g. very low dielectricloss) and small circuit size (e.g. low dielectric constant) whilemaintaining the thermal, physical and mechanical properties desirablefor PCB and other mobile devices.

BRIEF SUMMARY OF THE DISCLOSURE

In one aspect of the present disclosure is a resin having a generalstructure defined by Formulas (IA) and (IB):

wherein X is a moiety comprising a cyclopentadiene-based ring; B is H orX(A)_(s); L is a leaving group; each A is independently H, F, or asaturated or unsaturated, straight-chain or branched, linear or cyclic,substituted or unsubstituted, aliphatic or aromatic group having between1 and 40 carbon atoms, and which may optionally comprise one or moreheteroatoms; Z is a bond or a straight-chain or branched, substituted orunsubstituted, aliphatic group having between 1 and 20 carbon atoms; mis an integer ranging from 1 to 5; n is 0 or 1; o is 0 or 1; p is 0 oran integer ranging from 1 to 150; q is 0 or 1; r is an integer rangingfrom 1 to 4; s is an integer ranging from 1 to 5; w is 0 or an integerranging from 1 to 150; and x is 0 or 1.

In some embodiments, a dielectric value (Dk) of the resin ranges fromabout 1.5 to about 3. In some embodiments, the Dk value ranges fromabout 2.0 to about 2.8. In some embodiments, the Dk value is less than2.6. In some embodiments, the Dk value is less than 2.4. In someembodiments, a dissipation value (Df) of the resin ranges from about0.0001 to about 0.004. In some embodiments, the Df value ranges fromabout 0.0009 to about 0.003. In some embodiments, the Df value is lessthan about 0.002. In some embodiments, the Df value is less than about0.001. In some embodiments, a glass transition temperature (Tg) of theresin is greater than 100° C. In some embodiments, a glass transitiontemperature (Tg) of the resin is at least 150° C.

In some embodiments, the resins of any of Formulas (IA) or (IB) may bereacted with a dienophile or heterodienophile. In some embodiments, theresins of any of Formulas (IA) or (IB) may be reacted with a compoundhaving a maleimide group. In some embodiments, the resins of any ofFormulas (IA) or (IB) may be reacted with bis-maleimide or an analog orderivative thereof. In some embodiments, the resins of any of Formulas(IA) or (IB) may be reacted with benzoquinone or an analog or derivativethereof. In some embodiments, the resins of any of Formulas (IA) or (IB)may be reacted with an acrylate or a bis-acrylate.

In some embodiments, the resins of any of Formulas (IA) or (IB) have amolecular weight ranging from between about 100 g/mol and about 500g/mol. Of course, the skilled artisan will recognize that oligomers ofthe resins of Formulas (IA) or (IB) may have a molecular weight ofgreater than 500 g/mol. In other embodiments, the resins of any ofFormulas (IA) or (IB) have a molecular weight ranging from between about100 g/mol and about 400 g/mol. In yet other embodiments, the resins ofany of Formulas (IA) or (IB) have a molecular weight ranging frombetween about 100 g/mol and about 200 g/mol. In some embodiments, theresins of any of Formulas (IA) or (IB) may be blended with anotherpolymer or copolymer. In some embodiments, the resins of any of Formulas(IA) or (IB) may be reacted with a crosslinking agent.

In some embodiments, the moiety A has the general structure defined byFormula (IIB):

wherein Q is C, O, N, or S; R^(a), R^(b), R^(c), R^(d) are independentlyselected from H, F, a C₁ to C₁₀ linear or cyclic, saturated orunsaturated, branched or straight chain aromatic or aliphatic group; Tis —CH₂—, -phenyl, or —CH₂-phenyl; Y is H, —CH₃, —CH═CH₂, —CH═CH—CH₃, oran alkyne group; t and v are independently 0 or an integer ranging from1 to 20; u is 0 or 1; and z is an integer ranging from 1 to 5. In someembodiments, when T is -phenyl, or —CH₂-phenyl, and Y is —CH═CH₂,—CH═CH—CH₃, or an alkyne group, z is 1. In some embodiments, at leastone of t or v is at least 1, and Y is selected from the group consistingof —CH═CH₂, —CH═CH—CH₃, or an alkyne group. In some embodiments, t, u,and v are each 0, and Y is selected from the group consisting of—CH═CH₂, —CH═CH—CH₃, or an alkyne group.

In some embodiments, the moiety A has the general structure defined byFormula (IID):

wherein R^(a) and R^(b) are independently selected from H, F, a C₁ toC₁₀ linear or cyclic, branched or straight chain aliphatic group; Y isH, —CH₃, —CH═CH₂, —CH═CH—CH₃, or alkyne; and t is 0 or an integerranging from 1 to 20; z is an integer ranging from 1 to 5. In someembodiments, when Y is —CH═CH₂, —CH═CH—CH₃, or alkyne, z is 1. In someembodiments, the R^(a) and R^(b) are independently a C₁ to C₆ linear orcyclic, branched or straight chain aliphatic group. In some embodiments,z is 1 or 2. In other embodiments, z is 1.

In another aspect of the present disclosure are resins having thegeneral structure defined by Formulas (IVA), (IVB), (IVC):

wherein L is a leaving group; each A is independently H, F, or asaturated or unsaturated, straight-chain or branched, linear or cyclic,substituted or unsubstituted, aliphatic or aromatic group having between1 and 40 carbon atoms, and which may optionally comprise one or moreheteroatoms; Z is a bond or straight-chain or branched, substituted orunsubstituted, aliphatic group having between 1 and 20 carbon atoms; mis an integer ranging from 1 to 5; n is 0 or 1; o is 0 or 1; p is 0 oran integer ranging from 1 to 150; q is 0 or 1; r is an integer rangingfrom 1 to 4; s is an integer ranging from 1 to 5; w is 0 or an integerranging from 1 to 150; and x is 0 or 1.

In some embodiments, each moiety A independently has the structuredefined by Formula (IIA):

wherein R¹ is a bond, or a saturated or unsaturated straight-chain orbranched, linear or cyclic, substituted or unsubstituted, aliphatic oraromatic group having from about 1 to about 10 carbon atoms, Q is a bondor a linking group optionally comprising a heteroatom; T is a bond or—CH₂—, -phenyl, or —CH₂-phenyl; Y is H, —CH₃, —CH═CH₂, —CH═CH—CH₃, or analkyne group; t and v are independently 0 or an integer ranging from 1to 20; u is 0 or 1; and z is an integer ranging from 1 to 5.

In some embodiments, each of the groups (A)_(r), (A)_(m) and (A)_(s) ofany of Formulas (IVA), (IVB), or (IVC) are different. In someembodiments, (A)_(m) comprises a substituted or unsubstituted vinylbenzyl group; and wherein (A)_(s) is —CH₂—CH═CH₂. In some embodiments,(Z)_(n) is an unsubstituted alkyl group having from 2 to 6 carbon atoms.In some embodiments, the resin of Formulas (IVA), (IVB), (IVC) has thegeneral structure:

where w and p are independently an integer ranging from 1 to 150.

In some embodiments of the resins of Formulas (IVA), (IVB), and (IVC),n, q, and w and p are 1; o is 0 and x is 1; A comprises a moiety whichterminates in a group selected from —CH═CH₂, —CH═CH—CH₃ or alkyne; and Zcomprises an aliphatic group having at least three carbon atoms. Inother embodiments of the compounds of Formulas (IVA), (IVB), and (IVC),n, q, and w are 1; o is 0 and x is 1A comprises a moiety whichterminates in a group selected from H or —CH₃; and Z comprises analiphatic group having at least three carbon atoms. In other embodimentsof the compounds of Formulas (IVA), (IVB), and (IVC), n, q, and w are 1;o is 0 and x is 1; A comprises a moiety which terminates in an alkynegroup; and Z comprises an aliphatic group having at least three carbonatoms.

In some embodiments, the resins of any of Formulas (IVA), (IVB) or (IVC)may be reacted with a dienophile or heterodienophile. In someembodiments, the resins of any of Formulas (IVA) (IVB) or (IVC) may bereacted with a reagent having a maleimide group. In some embodiments,the resins of any of Formulas (IVB) or (IVC) may be reacted withbis-maleimide or an analog or derivative thereof. In some embodiments,the resins of any of Formulas (IVB) or (IVC) may be reacted withbenzoquinone or an analog or derivative thereof. In some embodiments,the resins of any of Formulas (IVB) or (IVC) may be reacted with anacrylate or a bis-acrylate. In some embodiments, the resins of any ofFormulas (IVA) (IVB) or (IVC) may be blended with another polymer orcopolymer. In some embodiments, the resins of any of Formulas (IA) or(IB) may be reacted with a crosslinking agent.

In another aspect of the present disclosure are resins having thegeneral structure defined by Formulas (VA) or (VB):

wherein each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;Z is a bond or straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms; m is an integerranging from 1 to 5; n is 0 or 1; o is 0 or 1; p is 0 or an integerranging from 1 to 150; q is 0 or 1; r is an integer ranging from 1 to 4;s is an integer ranging from 1 to 5; w is 0 or an integer ranging from 1to 150; and x is 0 or 1.

In some embodiments, p is an integer ranging from between 1 and 20, A ishydrogen, X is derived from cyclopentadiene, and (Z)_(n) is astraight-chain or branched aliphatic group having between 1 and 6 carbonatoms. In some embodiments, p is an integer ranging from between 1 and20, X is derived from cyclopentadiene substituted with one (A) moietythat is other than hydrogen, and B is X(A)₁.

In some embodiments, the resins of any of Formulas (VA) or (VB) may bereacted with a dienophile or heterodienophile. In some embodiments, theresins of any of Formulas (VA) or (VB) may be reacted with a compoundhaving a maleimide group. In some embodiments, the resins of any ofFormulas (VA) or (VB) may be reacted with bis-maleimide or an analog orderivative thereof. In some embodiments, the resins of any of Formulas(VA) or (VB) may be reacted with benzoquinone or an analog or derivativethereof. In some embodiments, the resins of any of Formulas (VA) or (VB)may be reacted with an acrylate or a bis-acrylate. In some embodiments,the resins of any of Formulas (VA) or (VB) may be blended with anotherpolymer or copolymer. In some embodiments, the resins of any of Formulas(IA) or (IB) may be reacted with a crosslinking agent.

In another aspect of the present disclosure is a resin having astructure defined by Formula (VI):

wherein X is cyclopentadiene; B is H; (Z)_(n) is a bond; m is rangesfrom 1 to 5; and A has the structure defined by Formula (IID):

R^(a) and R^(b) are independently selected from H, F, a C₁ to C₁₀ linearor cyclic, branched or straight chain aliphatic group; Y is H, —CH₃,—CH═CH₂, —CH═CH—CH₃, or alkyne; and t is 0 or an integer ranging from 1to 20. In some embodiments, t is 1; and R^(a) and R^(b) are each H. Insome embodiments, Y is —CH═CH₂. In some embodiments, m is 2, and a firstA group comprises a vinyl benzyl moiety; and wherein a second A group is—CH₂—CH═CH₂.

In some embodiments, the resin has the structure:

In some embodiments, the resins of Formula (VI) may be reacted with adienophile or heterodienophile. In some embodiments, the resins ofFormula (VI) may be reacted with a compound having a maleimide group. Insome embodiments, the resins of Formula (VI) may be reacted withbis-maleimide or an analog or derivative thereof. In some embodiments,the resins of Formula (VI) may be reacted with benzoquinone or an analogor derivative thereof. In some embodiments, the resins of Formula (VI)may be reacted with an acrylate.

In another aspect of the present disclosure is a resin having astructure defined by Formula (VII):

wherein Z has the structure defined by Formula (IIIA):

wherein R^(e) and R^(f) are independently selected from H, F, or astraight chain or branched alkyl group having between 1 and 6 carbonatoms; and y is an integer ranging from between 1 and about 20; m and sare independently an integer ranging from between 1 and about 5; each Ais independently selected from H or a moiety having a structure definedby Formula (IIC):

wherein R^(a) and R^(b) are independently selected from H, F, a C₁ toC₁₀ linear or cyclic, branched or straight chain aliphatic group; T is—CH₂—, -phenyl, or —CH₂-phenyl; Y is H, —CH₃, —CH═CH₂, —CH═CH—CH₃, oralkyne; t is 0 or an integer ranging from 1 to 20; u is 0 or 1; and z isan integer ranging from 1 to 5. In some embodiments, n is 1, and R^(e)and R^(f) are each H. In some embodiments, A is H. In some embodiments,y is 6. In some embodiments, y is 3. In some embodiments, the resin hasthe structure selected from the group consisting of:

In some embodiments, at least one of (A)_(m) or (A)_(s) comprise amoiety having the structure defined by Formula (IIC):

where R^(a) and R^(b) are each H. In some embodiments, Y is —CH═CH₂. Insome embodiments, R^(e) and R^(f) are each H. In some embodiments, y is6. In some embodiments, m is 1 and s is 0. In some embodiments, theresin has the structure:

In some embodiments, (A)_(m) and (A)_(s) each comprise a differentmoiety defined by Formula (IIC):

wherein R^(a) and R^(b) are independently selected from H, F, a C₁ toC₁₀ linear or cyclic, branched or straight chain aliphatic group; T is—CH₂—, -phenyl, or —CH₂-phenyl; Y is H, —CH₃, —CH═CH₂, —CH═CH—CH₃, oralkyne; t is 0 or an integer ranging from 1 to 20; u is 0 or 1; and z isan integer ranging from 1 to 5.

In some embodiments, for (A)_(m), t is 1 and T is phenyl; and for(A)_(s) t is 1 and u is 0. In some embodiments, for (A)_(m), t is 1; Tis phenyl, and Y is —CH═CH₂; and for (A)_(s) t is 1, u is 0, and Y is—CH═CH₂. In some embodiments, the resin has the structure:

In another aspect of the present disclosure are low dielectric materialshaving such characteristics which particularly useful as materials foruse in the aerospace industry, communications industry, and electronicsindustry. For example, the resins, polymers, blends, etc. disclosedherein may be used in printed circuit boards, as substrates forintegrated circuits, or as substrates or packaging for othermicroelectronic circuits or applications.

In another aspect of the present disclosure is a composition comprisinga first resin of Formulas (IA) or (IB) and a second resin of Formulas(IA) or (IB), wherein each of the first and second resins are different(e.g. differing in at least one moiety and/or the number of repeatgroups and/or the positioning of any moiety on any ring). In someembodiments, the first resin is present in the composition in an amountranging from between about 1% to about 99% by weight of the composition.In some embodiments, the first resin is present in the composition in anamount ranging from between about 10% to about 90% by weight of thecomposition. In some embodiments, the first resin is present in thecomposition in an amount ranging from between about 20% to about 80% byweight of the composition. In some embodiments, the first resin ispresent in the composition in an amount ranging from between about 30%to about 70% by weight of the composition. In some embodiments, thefirst resin is present in the composition in an amount ranging frombetween about 40% to about 60% by weight of the composition. In someembodiments, the first resin is present in the composition in an amountranging from between about 50% to about 50% by weight of thecomposition. In some embodiments, the first resin is present in thecomposition in an amount ranging from between about 60% to about 40% byweight of the composition. In some embodiments, the first resin ispresent in the composition in an amount ranging from between about 70%to about 30% by weight of the composition. In some embodiments, thefirst resin is present in the composition in an amount ranging frombetween about 80% to about 20% by weight of the composition. In someembodiments, the first resin is present in the composition in an amountranging from between about 90% to about 10% by weight of thecomposition. In some embodiments, the first resin is present in thecomposition in an amount ranging from between about 99% to about 1% byweight of the composition.

In some embodiments, the composition further comprises at least a thirdresin of Formulas (IA) or (IB), wherein the third resin is differentthan the first and second resins. Of course, the skilled artisan willappreciate that the first resin component and the second resin componentmay be provided in any ratio relative to one another. Likewise, anyadditional resins (nth resins) that are added to the composition mayalso be present in any ratio.

In another aspect of the present disclosure is a polymer (includingcopolymers and interpenetrating polymer networks, as defined herein)derived from one or more resins of Formulas (IA) or (IB). In someembodiments, the at least one of the resins of Formulas (IA) or (IB)comprises at least one A moiety terminating in one of a —CH═CH₂ group,alkyne group, or a —CH═CH—CH₃ group. In some embodiments, the polymerfurther comprises an additive selected from the group consisting ofadhesion agents, peroxides/crosslinking agents, antioxidants, flameretardants, diluents and fillers. In some embodiments, the polymersderived from one or more resins of Formulas (IA) or (IB) may be reactedwith a dienophile or a crosslinking agent. In some embodiments, thepolymers derived from one or more resins of Formulas (IA) or (IB) may beblended with another polymer that is not derived from one or more resinsof Formulas (IA) or (IB). In some embodiments, the Dk value ranges fromabout 2.0 to about 2.8. In some embodiments, the Df value ranges fromabout 0.0001 to 0.004.

In another aspect of the present disclosure is a co-polymer derived froma first resin of Formulas (IA) or (IB) and a second resin of Formulas(IA) or (IB), wherein the first and second resins are different.

In another aspect of the present disclosure is a co-polymer (includinginterpenetrating polymer networks, as defined herein) derived from aresin of any of Formulas (IA) or (IB), and a second component thatdiffers from the resin of Formulas (IA) or (IB). In some embodiments,the second component is selected from the group consisting ofpolyethylenes, polypropylenes, polybutylenes, low vinyl polybutadienes(predominantly 1,3 addition), high vinyl polybutadienes (significant 1,2addition), polystyrenes, butadiene-styrene copolymers, SMA polymers, ABSpolymers, polydicyclopentadienes, epoxies, polyurethanes, cyanateesters, poly(phenylene oxide), EPDM polymers, cyclic olefin copolymers(COC), polyimides, bismaleimides, phosphazenes, olefin-modifiedphosphazenes, acrylates, vinyl esters, polylactones, polycarbonates,polysulfones, polythioethers, polyetheretherketones (PEEK),polydimethylsiloxanes (PDMS), polyethylene terephthalates (PET),polybutylene terephthalates (PBT), and other commercially-availablepolymers. In some other embodiments, the second component is selectedfrom the group consisting of styrene, divinylbenzene,1,2-bis(vinylphenyl)ethane, vinylbenzyl ether compounds, vinyl ethercompounds, allyl ether compounds, vinylphenyl monomers, vinyl monomers,allyl monomers, or derivatives of such components.

In another aspect of the present disclosure is a composition comprising(a) either (i) a resin of any of Formulas (IA) or (IB); (ii) a polymerformed from a resin of any of Formulas (IA) or (IB); or (iii) anoligomer formed from a resin of any of Formulas (IA) or (IB); and (b) asuitable solvent, the solvent being present in an amount ranging fromabout 1% to about 99% by total weight of the composition.

In another aspect of the present disclosure is a resin having thegeneral structure defined by any of Formulas (XIIC) or (XIID):

wherein X is a moiety comprising a cyclopentadiene-based ring;

Z has the structure defined by Formula (IIIA):

where R^(e) and R^(f) are independently selected from H, F, or astraight chain or branched alkyl group having between 1 and 6 carbonatoms; and y is an integer ranging from between 1 and about 20;

the moiety A is H or a moiety having a structure defined by Formula(IIC):

wherein R^(a) and R^(b) are independently selected from H, F, a C₁ toC₁₀ linear or cyclic, branched or straight chain aliphatic group; T is—CH₂—, -phenyl, or —CH₂-phenyl; Y is H, —CH₃, —CH═CH₂, —CH═CH—CH₃, oralkyne; m is an integer ranging from 1 to 5; n is 0 or 1; p is 0 or aninteger ranging from 1 to 150; r is an integer ranging from 1 to 4; t is0 or an integer ranging from 1 to 20; u is 0 or 1; and w is 0 or aninteger ranging from 1 to 150; x is 0 or 1, z is an integer ranging from1 to 5;

R¹³ is a saturated or unsaturated, straight-chain or branched, linear orcyclic, substituted or unsubstituted, aliphatic or aromatic group havingbetween 1 and 50 carbon atoms, and which may be substituted with one ormore heteroatoms selected from O, N, or S;

R¹⁴ is a saturated or unsaturated, straight-chain or branched, linear orcyclic, substituted or unsubstituted, aliphatic or aromatic group havingbetween 1 and 40 carbon atoms; —(R¹³)_(k)—R¹⁵—, —R¹⁵—(R¹³)_(k)— or—R¹⁵—(R¹³)_(k)—R¹⁵—;

each R¹⁵ is independently a saturated or unsaturated, straight-chain orbranched, linear or cyclic, substituted or unsubstituted, aliphatic oraromatic group having between 1 and 40 carbon atoms; and k is an integerranging from 1 to 10.

In some embodiments, R¹⁴ comprises -[Aryl]-[Alkyl]-[Aryl], where eacharyl group may be independently substituted or unsubstituted, and wherethe alkyl group comprises between 1 and 20 carbon atoms. In someembodiments, each [Aryl] group is optionally substituted with a C₁-C₁₀straight chain or branched alkyl group.

In some embodiments, R¹⁴ has the structure defined by Formula (XIVa):

wherein each alkyl group is independently straight chain or branched andcomprises between 1 and 10 carbon atoms; and where each h isindependently 0 or an integer ranging from 1 to 4.

In some embodiments, the resins any of Formulas (XIIC) or (XIID) have adielectric value (Dk) ranging from about 1.5 to about 3. In someembodiments, the resins of any of Formulas (XIIC) or (XIID) have adissipation value (Df) ranging from about 0.0001 to about 0.004.

In another aspect of the present disclosure is a composition comprisinga blend of one or more compounds of any of Formulas (XIIC) or (XIID). Insome embodiments, a ratio of a first compound of any of Formulas (XIIC)or (XIID) to a second compound of any of any of Formulas (XIIC) or(XIID) ranges from about 1:10 to about 10:1. In some embodiments, theratio ranges from about 1:5 to about 5:1. In some embodiments, the ratioranges from about 1:2 to about 2:1.

In another aspect of the present disclosure is a compound having astructure defined by Formula (XIIE):

wherein R¹⁴ is a saturated or unsaturated, straight-chain or branched,linear or cyclic, substituted or unsubstituted, aliphatic or aromaticgroup having between 1 and 40 carbon atoms; —(R¹³)_(k)—R¹⁵—,—R¹⁵—(R¹³)_(k)— or —R¹⁵—(R¹³)_(k)—R¹⁵—;

R¹³ is a saturated or unsaturated, straight-chain or branched, linear orcyclic, substituted or unsubstituted, aliphatic or aromatic group havingbetween 1 and 50 carbon atoms, and which may be substituted with one ormore heteroatoms selected from O, N, or S; each R¹⁵ is independently asaturated or unsaturated, straight-chain or branched, linear or cyclic,substituted or unsubstituted, aliphatic or aromatic group having between1 and 40 carbon atoms; k is an integer ranging from 1 to 10;

each B is H or X(A)_(s);

X is a moiety comprising a cyclopentadiene-based ring;

each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;

each Z is a bond or straight-chain or branched, substituted orunsubstituted, aliphatic group having between 1 and 20 carbon atoms;each m is an integer ranging from 1 to 5; each n is 0 or 1; each q is 0or 1; and each s is an integer ranging from 1 to 5.

In some embodiments, each A within Formula (XIIE) is independently H ora moiety having a structure defined by Formula (IIC):

wherein R^(a) and R^(b) are independently selected from H, F, a C₁ toC₁₀ linear or cyclic, branched or straight chain aliphatic group; T is—CH₂—, -phenyl, or —CH₂-phenyl; Y is H, —CH₃, —CH═CH₂, —CH═CH—CH₃, oralkyne; t is 0 or an integer ranging from 1 to 20; u is 0 or 1; and z isan integer ranging from 1 to 5. In some embodiments, t is 1; R^(a) andR^(b) are each H; and Y is —CH═CH₂. In some embodiments, T is phenyl andu is 1.

In some embodiments, R¹⁴ has the structure defined by Formula (XIVa):

wherein each -[Alkyl]- group is independently straight chain or branchedand comprises between 1 and 10 carbon atoms; and where each h isindependently 0 or an integer ranging from 1 to 4. In some embodiments,at least one (Alkyl)_(h) group is —CH₃. In some embodiments, R¹⁴comprises a substituted phenyl group. In some embodiments, R¹⁴ comprisesa branched alkyl group comprising between 1 and 10 carbon atoms.

In some embodiments, the compound of Formula (XIIE) has the structuredefined by Formula (XIIF):

wherein each R¹⁶ is independently H or a substituted or unsubstituted,linear or branched, linear or cyclic alkyl group having between 1 and 10carbon atoms.

In some embodiments, each R¹⁶ is independently H or a straight chain orbranched alkyl group having from 1 to 4 carbons. In some embodiments, nand q are 0, and wherein at least one (A)_(m) moiety comprises a vinylbenzyl group. In some embodiments, the compound has a Dk value rangingfrom about 1.5 to about 3.

In some embodiments, the compound has a Df value ranging from about0.0001 to 0.004. In some embodiments, the compound has a Tg value ofgreater than 100° C.

In another aspect of the present disclosure is a composition comprisinga blend of one or more compounds of any of Formulas (XIIE) or (XIIF). Insome embodiments, a ratio of a first compound of any of Formulas (XIIE)or (XIIF) to a second compound of any of any of Formulas (XIIE) or(XIIF) ranges from about 1:10 to about 10:1. In some embodiments, theratio ranges from about 1:5 to about 5:1. In some embodiments, the ratioranges from about 1:2 to about 2:1.

In another aspect of the present disclosure is a reaction product of:

(i) a compound defined by Formulas (IA) or (IB):

wherein X is a moiety comprising a cyclopentadiene-based ring; B is H orX(A)_(s); L is a leaving group; each A is independently H, F, or asaturated or unsaturated, straight-chain or branched, linear or cyclic,substituted or unsubstituted, aliphatic or aromatic group having between1 and 40 carbon atoms, and which may optionally comprise one or moreheteroatoms; Z is a bond or straight-chain or branched, substituted orunsubstituted, aliphatic group having between 1 and 20 carbon atoms; mis an integer ranging from 1 to 5; n is 0 or 1; o is 0 or 1; p is 0 oran integer ranging from 1 to 150; q is 0 or 1; r is an integer rangingfrom 1 to 4; s is an integer ranging from 1 to 5; w is 0 or an integerranging from 1 to 150; x is 0 or 1; and

(ii) a dienophile. In some embodiments, the dienophile is selected fromthe group consisting of a bis-maleimide, a derivative of abis-maleimide, a maleic anhydride, a derivative of a maleic anhydride, abenzoquinone, a derivative of a benzoquinone, bis-acrylate, and anacrylate. In some embodiments, the reaction products have a dielectricvalue ranging from about 1.5 to about 3. In some embodiments, thereaction products have a dissipation value ranging from about 0.0001 toabout 0.004.

In another aspect of the present disclosure is a product formed byreacting:

(i) a resin having the structure defined by Formula (VI):

wherein X is a moiety comprising a cyclopentadiene-based ring; B is H orX(A)_(s); each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;Z is a bond or straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms; m is an integerranging from 1 to 5; n is 0 or 1; q is 0 or 1; and s is an integerranging from 1 to 5; and

(ii) a bis-maleimide.

In some embodiments, the bis-maleimide has a structure selected from thegroup consisting of:

-   -   wherein each R is independently selected from hydrogen, an aryl        group, a substituted aryl group, an aliphatic group, a        substituted aliphatic group, a cyclic aliphatic group, and a        substituted cyclic aliphatic group.

In some embodiments, the bis-maleimide is selected from the groupconsisting of 1,6′-bismaleimide-(2,2,4-trimethyl)hexane,4,4′-Diphenylmethanebismaleimide, Polyphenylmethanebismaleimide,N,N′-(4-methyl-m-phenylene)-bismaleimide, N,N′-m-phenylenebismaleimide,bisphenol A diphenyl ether bismaleimide,3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide,N,N′-[Methylenebis(2,6-diethyl-4,1-phenylene)]bis(maleimide,N,N′-[Methylenebis(2-isopropyl-6-methyl-4,1-phenylene)]bis(maleimide),1,2-bis(maleimido)ethane, 1,4-bis(maleimido)butane, and1,6-bis(maleimido)hexane; Bismaleimides derived from C30-C40 dimeracids; and bismaleimides with longer alkyl bridging groups such as thosesold by Designer Molecules Inc. (BMI-689 and BMI-3000).

In some embodiments, the product has a Dk value ranging from about 1.5to about 3. In some embodiments, product has a Df value ranging fromabout 0.0001 to 0.004.

In another aspect of the present disclosure are kits comprising any ofthe resins, polymers, blends, etc. disclosed herein. In someembodiments, the resins, polymers, blends, etc. are mixed with asuitable solvent. In some embodiments, the kits comprise multipleresins, polymers, blends, etc., where each of the resins, polymers,blends, etc. are provided in a separate container. In some embodiments,the kits include a resin and other reactants, reagents, or solvents. Forexample, a kit may include a resin of any of Formulas (IA) or (IB) andalso may include a bis-maleimide, such that the resin and thebis-maleimide may be reacted to form a product. In some embodiments, thekits further comprise instructions.

Applicants have surprisingly discovered that the resins, polymers,copolymers, and compositions described herein have a dielectric valueranging from about 1.5 to about 3, and/or a dissipation value rangingfrom about 0.0001 to about 0.004, allowing the resins, polymers,copolymers, and compositions to be materials suitable for use variousapplications across many industries. Applicants have also surprisinglydiscovered that the resins, polymers, copolymers, and compositions aresuitable for use in high speed communications applications (e.g. 5Gcommunication systems, devices, and networks).

DETAILED DESCRIPTION

An object of the disclosure is to provide a dielectric material with lowdielectric loss, which has excellent dielectric properties, lowcoefficient of thermal expansion and low water absorption.

Definitions

It should also be understood that, unless clearly indicated to thecontrary, in any methods claimed herein that include more than one stepor act, the order of the steps or acts of the method is not necessarilylimited to the order in which the steps or acts of the method arerecited. It should also be understood that where a variable (e.g. “w”)is used more than once in any formula or chemical structure, that eachuse of the variable in the formula or chemical structure is independentfrom any other use, unless explicitly noted otherwise. For example, ifthe variable “w” is used twice within the same formula, each “w′” may bethe same or different, i.e. if “w” is defined as 0 or an integer rangingfrom 1 to 150, each “w” may independently be selected from 0 or aninteger ranging from 1 to 150. Likewise, and again by way of example, ifthe moiety “R⁵” is defined as —CH— or —C—R¹², then each time R⁵ is usedin a formula or chemical structure, each R⁵ may independently beselected from —CH— or —C—R¹².

As used herein, the singular terms “a,” “an,” and “the” include pluralreferents unless context clearly indicates otherwise. Similarly, theword “or” is intended to include “and” unless the context clearlyindicates otherwise. The term “includes” is defined inclusively, suchthat “includes A or B” means including A, B, or A and B.

Ranges may be expressed herein as from “about” one particular value,and/or to “about” another particular value. When such a range isexpressed, another aspect includes from the one particular value and/orto the other particular value. Similarly, when values are expressed asapproximations, by use of the antecedent “about,” it will be understoodthat the particular value forms another aspect. It will be furtherunderstood that the endpoints of each of the ranges are significant bothin relation to the other endpoint, and independently of the otherendpoint.

As used herein in the specification and in the claims, the phrase “atleast one,” in reference to a list of one or more elements, should beunderstood to mean at least one element selected from any one or more ofthe elements in the list of elements, but not necessarily including atleast one of each and every element specifically listed within the listof elements and not excluding any combinations of elements in the listof elements. This definition also allows that elements may optionally bepresent other than the elements specifically identified within the listof elements to which the phrase “at least one” refers, whether relatedor unrelated to those elements specifically identified. Thus, as anon-limiting example, “at least one of A and B” (or, equivalently, “atleast one of A or B,” or, equivalently “at least one of A and/or B”) canrefer, in one embodiment, to at least one, optionally including morethan one, A, with no B present (and optionally including elements otherthan B); in another embodiment, to at least one, optionally includingmore than one, B, with no A present (and optionally including elementsother than A); in yet another embodiment, to at least one, optionallyincluding more than one, A, and at least one, optionally including morethan one, B (and optionally including other elements); etc.

As used herein in the specification and in the claims, the terms“comprising,” “including,” “having,” and the like are usedinterchangeably and have the same meaning. Similarly, “comprises,”“includes,” “has,” and the like are used interchangeably and have thesame meaning. Specifically, each of the terms is defined consistent withthe common United States patent law definition of “comprising” and istherefore interpreted to be an open term meaning “at least thefollowing,” and is also interpreted not to exclude additional features,limitations, aspects, etc. Thus, for example, “a device havingcomponents a, b, and c” means that the device includes at leastcomponents a, b and c. Similarly, the phrase: “a method involving stepsa, b, and c” means that the method includes at least steps a, b, and c.Moreover, while the steps and processes may be outlined herein in aparticular order, the skilled artisan will recognize that the orderingsteps and processes may vary.

As used herein in the specification and in the claims, “or” should beunderstood to have the same meaning as “and/or” as defined above. Forexample, when separating items in a list, “or” or “and/or” shall beinterpreted as being inclusive, i.e., the inclusion of at least one, butalso including more than one, of a number or list of elements, and,optionally, additional unlisted items. Only terms clearly indicated tothe contrary, such as “only one of or “exactly one of,” or, when used inthe claims, “consisting of,” will refer to the inclusion of exactly oneelement of a number or list of elements. In general, the term “or” asused herein shall only be interpreted as indicating exclusivealternatives (i.e. “one or the other but not both”) when preceded byterms of exclusivity, such as “either,” “one of,” “only one of” or“exactly one of.”

As used herein, the term “alkyl” refers to a straight or branchedhydrocarbon chain that comprises a fully saturated (no double or triplebonds) hydrocarbon group. By way of example only, the alkyl group mayhave 1 to 20 carbon atoms (whenever it appears herein, a numerical rangesuch as “1 to 20” refers to each integer in the given range; e.g., “1 to20 carbon atoms” means that the alkyl group may consist of 1 carbonatom, 2 carbon atoms, 3 carbon atoms, etc., up to and including 20carbon atoms, although the present definition also covers the occurrenceof the term “alkyl” where no numerical range is designated). As notedfurther herein, the alkyl group of the compounds may be designated as“C₁-C₄ alkyl” or similar designations. By way of example only, “C₁-C₄alkyl” indicates that there are one to four carbon atoms in the alkylchain, i.e., the alkyl chain is selected from methyl, ethyl, propyl,iso-propyl, n-butyl, iso-butyl, sec-butyl, and t-butyl. Typical alkylgroups include, but are in no way limited to, methyl, ethyl, propyl,isopropyl, butyl, isobutyl, tertiary butyl, pentyl and hexyl. The alkylgroup may be substituted or unsubstituted.

As used herein, the term “alkenyl” refers to an alkyl group thatcontains in the straight or branched hydrocarbon chain one or moredouble bonds. An alkenyl group may be unsubstituted or substituted.

As used herein, the term “alkynyl” refers to an alkyl group thatcontains in the straight or branched hydrocarbon chain one or moretriple bonds. An alkynyl group may be unsubstituted or substituted.

As used herein, the term “aryl” means an aromatic carbocyclic radical ora substituted carbocyclic radical containing preferably from 6 to 10carbon atoms, such as phenyl or naphtyl or phenyl or naphtyl, optionallysubstituted by at least one of the substituents selected in the groupconstituted by alkyl, alkenyl, alkynyl, aryl, aralkyl, hydroxy, alkoxy,aryloxy, aralkoxy, carboxy, aroyl, halo, nitro, trihalomethyl, cyano,alkoxycarbonyl, aryloxycarbonyl, aralkoxycarbonyl, acylamino,aroylamino, carbamoyl, alkylcarbamoyl, dialkylcarbamoyl, alkylthio,arylthio, alkylene or —NYY′ where Y and Y′ are independently hydrogen,alkyl, aryl, or aralkyl.

As used herein, the term “blend” refers, in some embodiments, to amixture of two or more different species of resins or a resin andanother polymer or copolymer.

As used herein, the terms “cure” or “curing” refer to processes ofhardening a resin material.

As used herein, “cycloalkyl” of like terms (e.g. a cyclic alkyl group)refer to a completely saturated (no double or triple bonds) mono- ormulti-cyclic hydrocarbon ring system. When composed of two or morerings, the rings may be joined together in a fused fashion. Cycloalkylgroups can contain 3 to 10 atoms in the ring(s) or 3 to 8 atoms in thering(s). A cycloalkyl group may be unsubstituted or substituted. Typicalcycloalkyl groups include, but are in no way limited to, cyclopropyl,cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl and cyclooctyl.

As used herein, “C_(a) to C_(b)” in which “a” and “b” are integers referto the number of carbon atoms in an alkyl, alkenyl or alkynyl group, orthe number of carbon atoms in the ring of a cycloalkyl, cycloalkenyl,cycloalkynyl or aryl group, or the total number of carbon atoms andheteroatoms in a heteroalkyl, heterocyclyl, heteroaryl orheteroalicyclyl group. That is, the alkyl, alkenyl, alkynyl, ring of thecycloalkyl, ring of the cycloalkenyl, ring of the cycloalkynyl, ring ofthe aryl, ring of the heteroaryl or ring of the heteroalicyclyl cancontain from “a” to “b”, inclusive, carbon atoms. Thus, for example, a“C₁ to C₄ alkyl” group refers to all alkyl groups having from 1 to 4carbons, that is, CH₃—, CH₃CH₂—, CH₃CH₂CH₂—, (CH₃)₂CH—, CH₃CH₂CH₂CH₂—,CH₃CH₂CH(CH₃)— and (CH₃)₃C—. If no “a” and “b” are designated withregard to an alkyl, alkenyl, alkynyl, cycloalkyl cycloalkenyl,cycloalkynyl, aryl, heteroaryl or heteroalicyclyl group, the broadestrange described in these definitions is to be assumed.

As used herein, the terms “halogen atom” or “halogen” mean any one ofthe radio-stable atoms of column 7 of the Periodic Table of theElements, such as, fluorine, chlorine, bromine and iodine.

As used herein, the term “interpenetrating network,” in accordance withthe definition adopted by the IUPAC, refers to a polymeric systemcomprising two or more networks which are at least partially interlacedon a molecular scale, to form both chemical and physical bonds betweenthe networks. The networks of an IPN cannot be separated unless chemicalbonds are broken. In other words, an IPN structure represents two ormore polymer networks that are partially chemically cross-linked and/orpartially physically entangled.

As used herein, the term “polymer” is defined as being inclusive ofhomopolymers, copolymers, interpenetrating networks, and oligomers.Thus, the term polymer may be used interchangeably herein with the termhomopolymers, copolymers, interpenetrating polymer networks, etc. Theterm “homopolymer” is defined as a polymer derived from a single speciesof monomer. The term “copolymer” is defined as a polymer derived frommore than one species of monomer, including copolymers that are obtainedby copolymerization of two monomer species, those obtained from threemonomers species (“terpolymers”), those obtained from four monomersspecies (“quaterpolymers”), etc. The term “oligomer” is defined as a lowmolecular weight polymer in which the number of repeating units does notexceed twenty. The term “copolymer” is further defined as beinginclusive of random copolymers, alternating copolymers, graftcopolymers, and block copolymers. Copolymers, as that term is usedgenerally, include interpenetrating polymer networks. The term “randomcopolymer” is defined as a copolymer comprising macromolecules in whichthe probability of finding a given monomeric unit at any given site inthe chain is independent of the nature of the adjacent units. In arandom copolymer, the sequence distribution of monomeric units followsBernoullian statistics. The term “alternating copolymer” is defined as acopolymer comprising macromolecules that include two species ofmonomeric units in alternating sequence.

Whenever a group or moiety is described as being “substituted” or“optionally substituted” (or “optionally having” or “optionallycomprising”) that group may be unsubstituted or substituted with one ormore of the indicated substituents. Likewise, when a group is describedas being “substituted or unsubstituted” if substituted, thesubstituent(s) may be selected from one or more the indicatedsubstituents. If no substituents are indicated, it is meant that theindicated “optionally substituted” or “substituted” group may besubstituted with one or more group(s) individually and independentlyselected from alkyl, alkenyl, alkynyl, cycloalkyl, cycloalkenyl,cycloalkynyl, aryl, heteroaryl, heteroalicyclyl, aralkyl, heteroaralkyl,(heteroalicyclyl)alkyl, hydroxy, protected hydroxyl, alkoxy, aryloxy,acyl, mercapto, alkylthio, arylthio, cyano, cyanate, halogen,thiocarbonyl, O-carbamyl, N-carbamyl, O-thiocarbamyl, N-thiocarbamyl,C-amido, N-amido, S-sulfonamido, N-sulfonamido, C-carboxy, protectedC-carboxy, O-carboxy, isocyanato, thiocyanato, isothiocyanato, nitro,silyl, sulfenyl, sulfinyl, sulfonyl, haloalkyl, haloalkoxy,trihalomethanesulfonyl, trihalomethanesulfonamido, an amino, ether,amino (e.g. a mono-substituted amino group or a di-substituted aminogroup), and protected derivatives thereof. Any of the above groups mayinclude one or more heteroatoms, including O, N, or S. For example,where a moiety is substituted with an alkyl group, that alkyl group maycomprise a heteroatom selected from O, N, or S (e.g.—(CH₂—CH₂—O—CH₂—CH₂)—).

The term “prepreg” as used herein refers to a reinforcing fabric whichhas been pre-impregnated with a resin system.

Resins or Compositions Comprising More than One Resin

In one aspect of the present disclosure are resins, including resinsdefined by Formulas (IA) and (IB). In another aspect of the presentdisclosure are compositions comprising mixtures of the resins ofFormulas (IA) and (IB). For example, a composition may comprise a firstresin of Formula (IA) and a second resin of Formula (IB), wherein thefirst and second resins differ in at least one substituent or moiety orin the number of any repeating groups. Of course, the skilled artisanwill appreciate that any composition may comprise any number of resinsof Formulas (IA) or (IB), and any of the different resins may be presentin the same or differing amounts within the composition. By way of afurther example, a composition may comprise a first resin of Formulas(IA) or (IB), a second resin of Formulas (IA) or (IB), and a third resinof Formulas (IA) or (IB), wherein each of the first, second, and thirdresins differ in at least one substituent, and where the first resin ispresent in an amount ranging from between about 20% to about 40% byweight of the composition, the second resin is present in an amountranging from 10% to about 30% by weight of the composition, and thethird resin constitutes the remainder of the composition by weight ofthe composition.

In one aspect of the present disclosure are resins having the structuredefined by Formulas (IA) and (IB):

wherein

X is a moiety comprising a cyclopentadiene-based ring;

B is H or X(A)_(s);

L is a leaving group.

each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;

Z is a bond or straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms;

m is an integer ranging from 1 to 5;

n is 0 or 1;

o is 0 or 1;

p is 0 or an integer ranging from 1 to 150;

q is 0 or 1;

r is an integer ranging from 1 to 4;

s is an integer ranging from 1 to 5;

w is 0 or an integer ranging from 1 to 150; and

x is 0 or 1.

The skilled artisan will appreciate that in certain embodiments ofFormula (IA) or (IB) where n is 0, Z may be a bond.

When it is denoted that any of the resins of Formulas (IA) or (IB) maydiffer from one another, it is meant that the resins may differ (i) inany moiety constituting the resin; (ii) the number of any of the repeatgroups of the moiety that are present, (iii) the positioning of anymoiety along any cyclic or aromatic group; and/or (iv) isomeric orstereochemical differences between the various moieties and/or groups.

The skilled artisan will appreciate that any group X, or for that matterany group B when B is X(A)_(s), may be substituted with any number of Agroups as denoted in Formulas (IA) and (IB). Where any single X groupcomprises multiple A groups, each of the A groups may be the same ordifferent. For example, where X is derived from cyclopentadiene and m is2, X may be substituted with a first A group and with a second A group,where the first and second A groups are different. Likewise, different Xgroups may comprise a same or a different number of A groups and, ofcourse, the same or different A groups, without limitation.

In some embodiments, p is an integer ranging from 1 to 100. In otherembodiments, p is an integer ranging from 1 to 75. In yet otherembodiments, p is an integer ranging from 1 to 50. In furtherembodiments, p is an integer ranging from 1 to 20. In even furtherembodiments, p is an integer ranging from 1 to 10. In yet furtherembodiments, p is 0. In some embodiments, w is an integer ranging from 1to 100. In other embodiments, w is an integer ranging from 1 to 75. Inyet other embodiments, w is an integer ranging from 1 to 50. In furtherembodiments, w is an integer ranging from 1 to 20. In even furtherembodiments, w is an integer ranging from 1 to 10. In yet furtherembodiments, w is 0.

In some embodiments, L is a halide or —OH. In other embodiments, L isselected from the group consisting of F, Cl, Br and —OH.

As used herein, the terms “cyclopentadiene-based ring” or“cyclopentadiene” (used interchangeably herein) is not limited tocyclopentadiene, but includes derivatives of cyclopentadiene, i.e. thosecontaining substituents other than hydrogen, or those capable of beingsubstituted with A groups as defined in Formulas (IA) or (IB). The terms“cyclopentadiene-based ring” or “cyclopentadiene” are also intended toinclude fused ring systems comprising, in part, a cyclopentadiene ring,e.g. an indene. By way of example, X may encompasses cyclopentadiene;indene; an indene substituted with one or more C₁ to C₄ straight-chainor branched alkyl groups; fluorene; and fluorene substituted with one ormore C₁ to C₄ straight-chain or branched alkyl groups. By way of afurther example, where it is denoted that X is a cyclopentadiene ring,this may refer to the base structure of X and, as will appreciated bythose of ordinary skill in the art, any of the “implicit” hydrogens ofthe cyclopentadiene ring may be substituted with any number of A groups,as denoted in Formulas (IA) or (IB).

In some embodiments, each —X(A)_(r)(Z)_(n)— group may be the same ordifferent. Likewise, each —X(A)_(m)(Z)_(n)— group may be the same ordifferent. In some embodiments, the compounds of Formula (IA) or (IB)comprise different —X(A)_(r)(Z)_(n)— groups or different—X(A)_(m)(Z)_(n)— groups, where each —X(A)_(r)(Z)_(n)— group or—X(A)_(m)(Z)_(n)— group is provided randomly, in blocks, or in randomblocks.

For example, the compounds of Formulas (IA) or (IB) may comprise twodifferent —X(A)_(r)(Z)_(n)— groups, wherein at least one of the—X(A)_(r)(Z)_(n)— groups comprises a different (A) moiety. By way of afurther example, the compounds of Formulas (IA) or (IB) may comprise afirst —X(A)_(r)(Z)_(n)— group substituted with a vinyl benzyl group, anda second —X(A)_(r)(Z)_(n)— group substituted with an allyl group, whereeach of the first and second —X(A)_(r)(Z)_(n)— groups may be distributedrandomly, in blocks, or in random blocks.

By way of yet another example, the compounds of Formulas (IA) or (IB)having different —X(A)_(r)(Z)_(n)— groups may have the structureprovided by Formula (IC):

where w and p are each independently an integer ranging from 1 to 150.

In some embodiments, the resins of Formulas (IA) or (IB) may have two,three or more different —X(A)_(m)(Z)_(n)— groups or two, three, or moredifferent —X(A)_(r)(Z)_(n)— groups, which may be provided randomlywithin the resin. In addition, while the skilled artisan will appreciatethat any two or more different —X(A)_(m)(Z)_(n)-groups or—X(A)_(r)(Z)_(n)— groups may differ in the (A) moiety included, thedifferent —X(A)_(m)(Z)_(n)— groups or —X(A)_(r)(Z)_(n)— groups mayinstead differ by virtue of the (Z) group included, or any combinationof (A) and/or (Z) groups.

In some embodiments, A has the structure defined by Formula (IIA):

wherein R¹ is a bond, or a saturated or unsaturated straight-chain orbranched, linear or cyclic, substituted or unsubstituted, aliphatic oraromatic group having from about 1 to about 10 carbon atoms,

Q is a bond or a linking group optionally comprising a heteroatom;

T is a bond or —CH₂—, -phenyl, or —CH₂-phenyl;

Y is H, —CH₃, —CH═CH₂, —CH═CH—CH₃, or an alkyne group;

t and v are independently 0 or an integer ranging from 1 to 20;

u is 0 or 1; and

z is an integer ranging from 1 to 5.

In some embodiments, when T is -phenyl, or —CH₂-phenyl, and Y is—CH═CH₂, —CH═CH—CH₃, or an alkyne group, z is 1.

In some embodiments, R¹ is —CH₂—. In other embodiments, R¹ is —C(CH₃)₂—.

In some embodiments, A has the structure defined by Formula (IIB):

wherein

Q is C, O, N, or S;

R^(a), R^(b), R^(c), R^(d) are independently selected from H, F, a C₁ toC₁₀ linear or cyclic, saturated or unsaturated, branched or straightchain aromatic or aliphatic group;

T is —CH₂—, -phenyl, or —CH₂-phenyl;

Y is H, —CH₃, —CH═CH₂, —CH═CH—CH₃, or an alkyne group;

t and v are independently 0 or an integer ranging from 1 to 20;

u is 0 or 1; and

z is an integer ranging from 1 to 5.

In some embodiments, wherein when T is -phenyl, or —CH₂-phenyl, and Y is—CH═CH₂, —CH═CH—CH₃, or an alkyne group, z is 1.

In some embodiments of the moieties of Formula (IIB), v is 0 or 1.

In some embodiments, at least one of t or v is at least 1. In someembodiments, at least one oft or v is 1, u is 1, and Y is selected fromthe group consisting of-CH═CH₂, —CH═CH—CH₃, or an alkyne group. In someembodiments, at least one oft is 1, u is 0, v is 0, and Y is selectedfrom the group consisting of-CH═CH₂, —CH═CH—CH₃, or an alkyne group.

In other embodiments, t, u, and v are each 0, and Y is selected from thegroup consisting of —CH═CH₂, —CH═CH—CH₃, or an alkyne group.

In some embodiments, R^(a), R^(b), R^(c), R^(d) are independentlyselected from H, F, a C₁ to C₆ straight chain or branched alkyl group; acyclopentadiene, —CH₂-cyclopentadiene, or —CH₂—CH₂-cyclopentadiene.

In some embodiments, Q is C, R^(a) and R^(b) are —CH₃, R^(c) and R^(d)are H, u is 0, and Y is —CH₃. In other embodiments, Q is C, R^(a) andR^(b) are —CH₃, R^(c) and R^(d) are H, u is 0, Y is —CH₃, and t is aninteger ranging from 1 to 6.

In some embodiments, Q is C, R^(a) and R^(b) are H, one of R^(c) andR^(d) is —CH₂—CH₃ or —CH₃, the other of R^(c) and R^(d) is—CH₂—CH₂—CH₂—CH₃ or —CH₂—CH₂—CH₂—CH₂—CH₃, u is 0, and Y is H. In otherembodiments, Q is C, R^(a) and R^(b) are H, one of R^(c) and R^(d) is—CH₂—CH₃ or —CH₃, the other of R^(c) and R^(d) is —CH₂—CH₂—CH₂—CH₃ or—CH₂—CH₂—CH₂—CH₂—CH₃, u is 0, Y is H, and t is an integer ranging from 1to 6.

In some embodiments, Q is C, R^(a) and R^(b) are H, one of R^(c) andR^(d) is —CH₂—CH₃ or —CH₃, the other of R^(c) and R^(d) is—CH₂—CH₂—CH₂—CH₃ or —CH₂—CH₂—CH₂—CH₂—CH₃, u is 0, and Y is —CH₃. Inother embodiments, Q is C, R^(a) and R^(b) are H, one of R^(c) and R^(d)is —CH₂—CH₃ or —CH₃, the other of R^(c) and R^(d) is —CH₂—CH₂—CH₂—CH₃ or—CH₂—CH₂—CH₂—CH₂—CH₃, u is 0, Y is —CH₃, and t is an integer rangingfrom 1 to 6.

In some embodiments, Q is C, R^(a) and R^(b) are H, R^(c) and R^(d) areboth —CH₃, u is 0, and Y is H. In some embodiments, Q is C, R^(a) andR^(b) are H, R^(c) and R^(d) are both —CH₃, u is 0, Y is H, and t is aninteger ranging from 1 to 6. In other embodiments, Q is C, R^(a) andR^(b) are H, R^(c) and R^(d) are both —CH₃, u is 0, and Y is —CH₃. Inother embodiments, Q is C, R^(a) and R^(b) are H, R^(c) and R^(d) areboth —CH₃, u is 0, Y is —CH₃, and t is an integer ranging from 1 to 6.

In some embodiments, Q is C, R^(a) and R^(b) are H, R^(c) and R^(d) areindependently selected from a cyclopentadiene or —CH₂-cyclopentadiene, uis 0, v is 1, and Y is CH₃. In other embodiments, Q is C, R^(a) andR^(b) are H, R^(c) and R^(d) are independently selected from acyclopentadiene or —CH₂-cyclopentadiene, u is 0, v is 1, and Y is H.

In some embodiments, A has the structure defined by Formula (IIC):

wherein

R^(a) and R^(b) are independently selected from H, F, a C₁ to C₁₀ linearor cyclic, branched or straight chain aliphatic group;

T is —CH₂—, -phenyl, or —CH₂-phenyl;

Y is H, —CH₃, —CH═CH₂, —CH═CH—CH₃, or alkyne;

t is 0 or an integer ranging from 1 to 20;

u is 0 or 1; and

z is an integer ranging from 1 to 5.

In some embodiments, when T is -phenyl, or —CH₂-phenyl, and Y is—CH═CH₂, —CH═CH—CH₃, or alkyne, z is 1.

In some embodiments, the R^(a) and R^(b) are independently a C₁ to C₆linear or cyclic, branched or straight chain aliphatic group. In someembodiments, the R^(a) and R^(b) are independently a C₁ to C₆ alkylgroup. In some embodiments, the R^(a) and R^(b) are independently a C₁to C₄ alkyl group.

In some embodiments, t is 1, u is 1, and Y is —CH═CH₂. In otherembodiments, t is 0, u is 1, and Y is —CH═CH₂. In yet other embodiments,t ranges from 1 to 10, R^(a) and R^(b) are independently H, —CH₂—CH₃,—CH(CH₃)—CH₃ or —CH₃ and u is 0. In further embodiments, t ranges from 1to 10, R^(a) and R^(b) are independently H, —CH₂—CH₃, —CH(CH₃)—CH₃ or—CH₃ and u is 1. In yet further embodiments, t is 0, u is 1, and Y is—CH═CH—CH₃. In yet further embodiments, t is 0, u is 1, and Y is alkyne.In even other embodiments, u is 1 and T is phenyl. In yet even furtherembodiments, t is 1, u is 1, T is phenyl, and R^(a) and R^(b) are bothH.

In some embodiments, A has the structure defined by Formula (IID):

wherein

R^(a) and R^(b) are independently selected from H, F, a C₁ to C₁₀ linearor cyclic, branched or straight chain aliphatic group; Y is H, —CH₃,—CH═CH₂, —CH═CH—CH₃, or alkyne; and t is 0 or an integer ranging from 1to 20; z is an integer ranging from 1 to about 5. In some embodiments,when Y is —CH═CH₂, —CH═CH—CH₃, or alkyne, z is 1. In some embodiments,the R^(a) and R^(b) are independently a C₁ to C₆ linear or cyclic,branched or straight chain aliphatic group. In some embodiments, z is 1or 2. In other embodiments, z is 1.

In some embodiments, the R^(a) and R^(b) are independently a C₁ to C₆alkyl group. In some embodiments, the R^(a) and R^(b) are independentlya C₁ to C₄ alkyl group.

The skilled artisan will appreciate that the group Y may be present atany position(s) along the phenyl ring. Of course, any resin of Formulas(IA) or (IB) may comprise different Y groups. Likewise, any resin ofFormulas (IA) or (IB) may comprise the same Y group, but the Y group maybe located at different positions along the phenyl ring. In addition,some A groups may comprise a single Y group while other A groups maycontain multiple Y groups, which may be the same or different or differin their positioning.

In some embodiments, t is an integer ranging from 1 to 6, R^(a) andR^(b) are both H, and Y is —CH═CH₂. In other embodiments, t is 1 or 2,R^(a) and R^(b) are both H, and Y is —CH═CH₂. In yet other embodiments,t is an integer ranging from 1 to 6, R^(a) and R^(b) are both H, and Yis —CH═CH₂. In other embodiments, t is 1 or 2, R^(a) and R^(b) are bothH, and Y is —CH═CH₂. In yet further embodiments, t is 1 or 2, R^(a) andR^(b) are both —CH₃, and Y is —CH═CH₂.

In some embodiments, Z has the structure defined by Formula (IIIA):

wherein

R^(e) and R^(f) are independently selected from H, F, or a straightchain or branched alkyl group having between 1 and 6 carbon atoms; and

y is an integer ranging from between 1 and about 20.

In some embodiments, R^(e) and R^(f) are independently selected from Hor a straight chain or branched alkyl group having between 1 and 4carbon atoms; and y is an integer ranging from between 1 and about 10.In other embodiments, R^(e) and R^(f) are independently selected from Hor a straight chain alkyl group having between 1 and 4 carbon atoms; andy is an integer ranging from between 1 and about 6.

In yet other embodiments, R^(e) and R^(f) are both H; and y is aninteger ranging from between 1 and about 10. In further embodiments,R^(e) and R^(f) are both H; and y is an integer ranging from between 1and about 6. In even further embodiments, R^(e) and R^(f) are both H;and y is an integer ranging from between 2 and about 6. In yet evenfurther embodiments, R^(e) and R^(f) are both H; and y is an integerranging from between 3 and about 6. In even further embodiments, R^(e)and R^(f) are both H; and y is 3. In even further embodiments, R^(e) andR^(f) are both H; and y is 6.

In some embodiments, R^(e) and R^(f) are independently selected from H,—CH₂—CH₃, or —CH₃. In other embodiments, one of R^(e) and R^(f) isselected from H or —CH₃, and the other of R^(e) and R^(f) is H. In yetother embodiments, R^(e) and R^(f) are both H.

In some embodiments, Z has the structure defined by Formula (IIIB):

where y is an integer ranging from between 1 and about 20. In someembodiments of the moieties of Formula (IIIB), y ranges from 1 to 6. Insome embodiments of the moieties of Formula (IIIB), y ranges from 1 to4. In some embodiments of the moieties of Formula (IIIB), y ranges from1 to 3. In some embodiments of the moieties of Formula (IIIB), y rangesfrom 2 to 6. In some embodiments of the moieties of Formula (IIIB), yranges from 2 to 4.

In some embodiments, Z has the structure defined by Formula (IIIC):

where y is as defined above. In some embodiments of the moieties ofFormula (IIIC), y ranges from 1 to 6. In some embodiments of themoieties of Formula (IIIC), y ranges from 1 to 4. In some embodiments ofthe moieties of Formula (IIIC), y ranges from 1 to 3. In someembodiments of the moieties of Formula (IIIC), y ranges from 2 to 6. Insome embodiments of the moieties of Formula (IIIC), y ranges from 2 to4.

In some embodiments, the compounds of Formula (IA) or (IB) have thestructure defined by Formulas (IVA), (IVB), or (IVC):

wherein

L is a leaving group;

each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;

Z is a bond or straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms;

m is an integer ranging from 1 to 5;

n is 0 or 1;

o is 0 or 1;

p is 0 or an integer ranging from 1 to 150;

q is 0 or 1;

r is an integer ranging from 1 to 4;

w is 0 or an integer ranging from 1 to 150; and

x is 0 or 1.

The skilled artisan will appreciate that the A groups, i.e. (A)_(m),(A)_(r) or (A)_(s), may be in any position along any of thecyclopentadiene-based group. The skilled artisan will also appreciatethat when more than one A group is present along any of thecyclopentadiene-based rings, that the A groups may be located on thesame or different positions in each cyclopentadiene-based group. Forexample, one

group may comprise an A group at a first ring position (e.g. one carbonaway from the carbon bearing the Z_(n) group) while another

group may comprise an A group at a second or third ring position (e.g.two or three carbons away from the carbon bearing the Z_(n) group).Likewise, and again by way of example, one group

may comprise an A group at a first ring position (e.g. one carbon awayfrom the carbon bearing the Z_(n) group) while another

group may comprise an A group at a second or third ring position (e.g.two or three carbons away from the carbon bearing the Z_(n) group).

In some embodiments of the compounds of Formula (IVA), (IVB), or (IVC),m, p, q, and x are 0; (Z)_(n) is a straight-chain or branched aliphaticgroup having between 1 and 20 carbon atoms; o is 1; and L is a leavinggroup. In other embodiments, m, p, q, and x are 0; (Z)_(n) is astraight-chain or branched aliphatic group having between 1 and 10carbon atoms, o is 1, and L is a leaving group. In yet otherembodiments, m, p, q, and x are 0; (Z)_(n) is a straight-chain orbranched aliphatic group having between 1 and 6 carbon atoms, o is 1,and L is a leaving group. In further embodiments, m, p, q, and x are 0;(Z)_(n) is a straight-chain alkyl group having between 1 and 6 carbonatoms, o is 1, and L is a leaving group. In further embodiments, m, p,q, and x are 0; (Z)_(n) is a straight-chain alkyl group having between 1and 4 carbon atoms, o is 1, and L is a leaving group. In some embodimentof the compounds of Formula (IVA), (IVB), or (IVC), m, p, q, and x are0; Z is an aliphatic group having between 1 and 6 carbon atoms; and L isa halide or —OH group.

In some embodiments of the compounds of Formula (IVA), (IVB), or (IVC),n, q, and w are 1; o is 0, x is 1; A comprises a moiety which terminatesin a group selected from —CH═CH₂, —CH═CH—CH₃ or alkyne; and Z comprisesan aliphatic group having at least three carbon atoms. In otherembodiments of the compounds of Formula (IVA), (IVB), or (IVC), n, q,and w are 1; o is 0, x is 1; A comprises a moiety which terminates in agroup selected from H or —CH₃; and Z comprises an aliphatic group havingat least three carbon atoms. In other embodiments of the compounds ofFormula (IVA), (IVB), or (IVC), n, q, and w are 1; o is 0, x is 1; Acomprises a moiety which terminates in an alkyne group; and Z comprisesan aliphatic group having at least three carbon atoms.

In some embodiments of the compounds of Formula (IVA), (IVB), or (IVC),n, q, and w are 1; o is 0, x is 1; A comprises a moiety which terminatesin hydrogen or a group selected from —CH═CH₂, —CH═CH—CH₃ or alkyne; andwherein the compounds of Formula (IVA), (IVB), or (IVC), comprise atleast two different

groups.

In some embodiments of the compounds of Formula (IVA), (IVB), or (IVC),n, q, and w are 1; o is 0, x is 1; and where the compounds of Formula(IV) comprise at least two different

groups, wherein a first subset of

groups comprise vinyl styrene moieties, and wherein a second subset of

groups comprise allyl moieties.

Likewise, in other embodiments of the compounds of Formula (IVA), (IVB),or (IVC), n, q, and w are 1; o is 0, x is 1; A comprises a moiety whichterminates in hydrogen or a group selected from —CH═CH₂, —CH═CH—CH₃ oralkyne; and wherein the compounds of Formula (IVA), (IVB), or (IVC),comprise at least two different

groups.

In some embodiments of the compounds of Formula (IVA), (IVB), or (IVC),n, q, and w are 1; o is 0, x is 1; and where the compounds of Formula(IV) comprise at least two different

groups, wherein a first subset of

groups comprise vinyl styrene moieties, and wherein a second subset of

groups comprise allyl moieties.

In some embodiments, the compounds of Formula (IA) or (IB) have thestructure defined by Formulas (VA) or (VB):

wherein

X is a moiety comprising a cyclopentadiene-based ring;

B is H or X(A)_(s);

each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;

Z is a bond or straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms;

m is an integer ranging from 1 to 5;

n is 0 or 1;

p is 0 or an integer ranging from 1 to 150;

q is 0 or 1;

r is an integer ranging from 1 to 4;

s is an integer ranging from 1 to 5; and

w is 0 or an integer ranging from 1 to 150.

In some embodiments of the compounds of Formula (VA) or (VB), p is aninteger ranging from between 1 and 20, and B is X(A)_(s). In someembodiments, p is an integer ranging from between 1 and 20, A ishydrogen, and X is cyclopentadiene or derived from cyclopentadiene. Insome embodiments, p is an integer ranging from between 1 and 20, A ishydrogen, X is cyclopentadiene or derived from cyclopentadiene, and(Z)_(n) is a straight-chain or branched aliphatic group having between 1and 6 carbon atoms. In some embodiments, p is an integer ranging frombetween 1 and 20, X is cyclopentadiene substituted with one (A) moietythat is other than hydrogen, and B is X(A)₁. In some embodiments, p isan integer ranging from between 1 and 20, X is cyclopentadienesubstituted with one (A) moiety that is other than hydrogen, B is X(A)₁,and (Z)_(n) is a straight-chain or branched aliphatic group havingbetween 1 and 6 carbon atoms.

In some embodiments, the compounds of Formula (IA) or (IB) have thestructure defined by Formula (VI):

wherein P34624-WO

X is a moiety comprising a cyclopentadiene-based ring;

B is H or X(A)_(s);

each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;

Z is a bond or straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms;

m is an integer ranging from 1 to 5;

n is 0 or 1;

q is 0 or 1; and

s is an integer ranging from 1 to 5.

In some embodiments of the compounds of Formula (VI), (Z)_(n) is a bond.In some embodiments of the compounds of Formula (VI), m is 2 and whereeach A group is different. In some embodiments, m is 2 and a first Agroup comprises a vinyl benzyl group and a second A group is—CH₂—CH═CH₂.

In some embodiments, X is cyclopentadiene, B is H; (Z)_(n) is a bond; mis ranges from 1 to 5; and A is as defined herein. In some embodiments,A is a moiety having the structure defined by Formula (IID).

In some embodiments, A is hydrogen, and X and B are both cyclopentadieneor derived from cyclopentadiene. In other embodiments, A is hydrogen, Xand B are both cyclopentadiene or derived from cyclopentadiene, and(Z)_(n) is a straight-chain or branched aliphatic group having between 1and 6 carbon atoms. In yet other embodiments, X is cyclopentadienesubstituted with one (A) moiety that is other than hydrogen, and B isX(A)₁. In further embodiments, X is cyclopentadiene substituted with one(A) moiety that is other than hydrogen, B is X(A)₁, and (Z)_(n) is astraight-chain or branched aliphatic group having between 1 and 6 carbonatoms.

In some embodiments, n and q are both 0. In some embodiments, n and qare both 0, and m is 1. In some embodiments, n and q are both 0, and mis 2. In some embodiments, n and q are both 0, and A terminates in amoiety selected from the group consisting a —CH═CH₂ group, a —CH═CH—CH₃group, and an alkyne group. In some embodiments, n and q are both 0, andA terminates in a moiety selected from the group consisting a —CH═CH₂group, a —CH═CH—CH₃ group, and an alkyne group, and m is 1. In someembodiments, n and q are both 0, and A terminates in a moiety selectedfrom the group consisting a —CH═CH₂ group, a —CH═CH—CH₃ group, and analkyne group, and m is an integer ranging from 1 to 3. In someembodiments, n and q are both 0, and A terminates in a moiety selectedfrom the group consisting a —CH═CH₂ group, a —CH═CH—CH₃ group, and analkyne group, and m is an integer ranging from 2 to 4. In someembodiments, n and q are both 0, and A terminates in a moiety selectedfrom the group consisting a —CH═CH₂ group, a —CH═CH—CH₃ group, and analkyne group, and m is 2.

In some embodiments, the compounds of Formula (VI) have the structuredefined by Formula (VII):

wherein each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;

Z is a bond or straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms;

m is an integer ranging from 1 to 5;

n is 0 or 1;

q is 0 or 1; and

s is an integer ranging from 1 to 5.

In some embodiments, the compounds of Formula (IVA) have the structuredefined by Formula (VIII):

wherein

each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;

Z is a bond or straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms;

m is an integer ranging from 1 to 5;

n is 0 or 1;

p is 0 or an integer ranging from 1 to 150;

r is an integer ranging from 1 to 4; and

s is an integer ranging from 1 to 5.

Specific non-limiting examples of the compounds of Formulas (IA) or (IB)are set forth below, each of which may be (i) blended with anotherpolymer, copolymer, or filler material; (ii) crosslinked with acrosslinking agent; (iii) polymerized to form homopolymers, copolymers,or interpenetrating polymer networks; and/or (iv) reacted with adienophile (as disclosed further herein). In some embodiments, each ofthe non-limiting examples of resins set forth below have a dielectricvalue (Dk) of the resin ranges from about 1.5 to about 3. In someembodiments, each of the non-limiting examples of resins set forth belowhave a dissipation value (Df) of the resin ranges from about 0.0001 toabout 0.004. In some embodiments, each of the non-limiting examples ofresins set forth below have a glass transition temperature (Tg) ofgreater than 100° C. In some embodiments, each of the non-limitingexamples of resins set forth below have a glass transition temperature(Tg) of at least 150° C. Of course, each of the non-limiting resinsrecited below may be included within a kit and/or may be supplied in asuitable solvent.

where w and p are independently an integer ranging from 1 to 150,

where w and p are each independently an integer ranging from 1 to 150.

General Synthetic Methods for Preparing the Compounds of Formulas (IA)and (IB)

In some embodiments, cyclopentadiene, a cyclopentadiene derivative, amoiety comprising a cyclopentadiene group, or a moiety comprising acyclopentadiene derivative is provided as a starting material which, inthe presence of a base (e.g. NaH), may be converted to the respectiveanion. Suitable bases may also include hydroxides and alkoxides, ifsuitable reaction conditions, catalysts, and equipment (such as in aphase-transfer process) are used in such a way as to allow for formationof the cyclopentadiene anion.

In some embodiments, the resins of Formulas (IA) or IB may besynthesized from the starting materials of any of Formulas (IXA), (IXB),or (IXC):

wherein R^(a) and R^(b) are independently selected from H, F, a C₁ toC₁₀ linear or cyclic, saturated or unsaturated, branched or straightchain aromatic or aliphatic group; T is —CH₂—, -phenyl, or —CH₂-phenyl;Y is H, —CH₃, —CH═CH₂, —CH═CH—CH₃, or an alkyne group; t is an integerranging from 1 to 20; u is 0 or 1; and L is a leaving group.

In some embodiments, a cyclopentadiene anion is generated by combinationof a compound including a cyclopentadiene group with an excess of astrong base, e.g. sodium hydride, in a suitable solvent (e.g. THF) atmoderate temperatures (typically between about 0° C. and about 100° C.).This cyclopentadiene anion solution can then be combined with desiredmolar equivalents of one or more starting materials of Formulas (IXA),(IXB), (IXC), (XA), (XB), and (XC) and allowed to react at moderatetemperature for about 30 minutes or until satisfactory conversion toproduct is achieved. Unreacted base can be neutralized or diluted byaddition of water, alcohol or acidic aqueous solution. Crude productmixtures may be isolated by in vacuo removal of reaction solvent. Higherpurity product mixtures may be achieved through combinations of dilutionin hydrocarbon solvents, filtration of insoluble reaction byproducts,washings with neutral or acidic aqueous solutions to remove reactionbyproducts, and removal of solvent in vacuo to produce high yields ofresins of Formulas (IA) or (IB). In other embodiments, a combination ofa compound including a cyclopentadiene; the desired molar equivalents ofone or more starting materials of Formulas (IXA), (IXB), (IXC), (XA),(XB), and (XC); and a tetra-alkyl ammonium chloride phase-transfercatalyst are mixed with a strong aqueous base solution (such as about 50weight % potassium hydroxide in water), and stirred vigorously untilproduct formation is complete. This biphasic reaction mixture generatescyclopentadiene anion in the presence of the reactive startingmaterials, yielding desired product. Product may be isolated byseparation of the organic layer, followed by washings with neutral oracidic aqueous solutions to remove reaction byproducts and catalyst togive high yields of resin of Formula (IA) or (IB).

For example, a compound including a cyclopentadiene group (e.g. such asthose defined herein as “X”) may first be treated with a base andsubsequently reacted with a compound of any of Formulas (IXA), (IXB), or(IXC) to provide a resin of Formulas (IA) or (IB).

A compound including a cyclopentadiene group may first be treated with abase and subsequently reacted with a compound of any of Formulas (XA),(XB), and (XC) to provide a resin of Formula (IA) or (IB):

The starting materials of Formulas (IXA), (IXB), (IXC), (XA), (XB), and(XC) and cyclopentadiene or a derivative thereof may be combined in anyorder to generate a thermosetting resin formulation meeting desiredcharacteristics. Preparation of the anion of cyclopentadiene or aderivative thereof can be completed before reaction with a compound ofany of Formulas (IXA), (IXB), (IXC), (XA), (XB), and (XC) and anyadditional reactive compounds. Alternatively, the anion ofcyclopentadiene or a derivative thereof can be generated in the presenceof a compound of any of Formulas (IXA), (IXB), (IXC), (XA), (XB), and(XC) and any additional reactive compounds such that the anion reactsquickly after formation.

Furthermore, after reaction of an anion of a cyclopentadiene or aderivative thereof and a compound of any of Formulas (IXA), (IXB),(IXC), (XA), (XB), and (XC) an initial reaction product is formed havingFormula (IA) or (IB). If sufficient strong base remains available thegenerated resin of Formulas (IA) or (IB) serving as an intermediate, maybecome further deprotonated, regenerating a stable anion capable offurther reaction with additional compounds of any of Formulas (IXA),(IXB), (IXC), (XA), (XB), and (XC) to form yet a different producthaving any of Formula (IA) or (IB). This process can repeat multipletimes. Likewise, reaction components can be combined in various ways toaffect the overall product distribution, as understood by those skilledin the art. If desired, one or more of the reactive components of thedisclosure can be formed in situ during the reaction process.

The viscosity of the thermosetting resin formulation can be tuned asdesired by moderation of the molar ratios of the reactive components andmolar equivalents of base. Increasing the base-to-cyclopentadiene or aderivative thereof molar ratio promotes multiple reactions between thecyclopentadiene or a derivative thereof and other reactive components,when the specific structure of the cyclopentadiene or a derivativethereof is capable of more than one formation of the reactive anion andthe viscosity of the product composition typically increases with anincrease in the average number of reactions per cyclopentadiene or aderivative thereof. Reaction of a cyclopentadiene or a derivativethereof with a compound of any of Formulas (IXA), (IXB), (IXC), (XA),(XB), and (XC) in molar ratios that favor formation of smaller moleculeslead to product compositions with lower viscosity, whereashigher-viscosity oligomeric compound distributions can be favored byusage of a compound of any of Formulas (IXA), (IXB), (IXC), (XA), (XB),and (XC) possessing more than one reactive leaving group per molecule.In some embodiments, about 1 equivalent of a cyclopentadiene or aderivative thereof is reacted with 2 or more equivalents of a compoundof any of Formulas (IXA), (IXB), (IXC), (XA), (XB), and (XC) in thepresence of 2 or more equivalents of strong base to form a productcomposition featuring 2 or more moieties capable of carbon-carbon bondforming reactions per cyclopentadiene or a derivative unit.

Reaction compounds may be combined at any temperature suitable to effectformation of an appropriate resin formulation. Reaction ofcyclopentadiene or a derivative thereof with strong base is typicallyperformed at temperatures from about −70° C. to about 200° C., withoptimal reaction temperatures depending heavily on properties of solventand equipment used in the chemistry. In some embodiments, the reactionis conducted at temperatures between about 20° C. to about 100° C.

The reaction may be conducted in any suitable solvent, including ethers(tetrahydrofuran, diglyme) and hydrocarbon solvents (xylene, toluene).The reaction may also be conducted in the absence of solvent, ifreaction components are sufficiently miscible to generate desiredproducts. Reactions may be conducted in biphasic systems of aqueous baseand organic reactants, with and without additional organic solvents, andwith or without added phase-transfer catalysts such as tetra-substitutedammonium salts. Product mixtures may be isolated by filtration of solidreaction byproducts (salts), solvent extractions to removeaqueous-soluble material, and removal of solvent by evaporation,distillation, or vacuum distillation.

Resins Formed as Reaction Product Between a Compound of Formula (IA) orFormula (IB) and a Dienophile

In another aspect of the present disclosure are resins formed as areaction product between (i) a resin of Formulas (IA) or (IB) containinga diene, and (ii) a dienophile (or a heterodienophile) (i.e. aDiels-Alder reaction product). The term “dienophile” refers to an alkenethat is reactive toward a diene to provide a 4+2 cycloaddition product.Dienophiles useful in the present methods and composition include, butare not limited to, carbon-containing dienophiles (e.g. alkenes oralkynes) with reduced electron density due to electronegative orresonance effects of adjacent electron-withdrawing groups—such assubstituents containing nitroso, carbonyl, or imido groups. In someembodiments, the dienophile is an alkene such as ethylene, propylene orother straight chain alkene (e.g. an acrylate), or a cyclic alkene (e.g.cyclopentadiene), as described herein.

In some embodiments, the dienophile is a bis-maleimide. The termbis-maleimide as used herein includes mono-, bis-, tris-, tetrakis-, andhigher functional maleimides and their mixtures. In some embodiments,bis-maleimide resins may be prepared by the reaction of maleic anhydrideor a substituted maleic anhydride such as methylmaleic anhydride, withan aromatic or aliphatic di- or polyamine. Examples of suitablebis-maleimides include, but are not limited to:1,6′-bismaleimide-(2,2,4-trimethyl)hexane (CAS 39979-46-9), BMI-3000 (aimide-extended BMI oligomer, available from Designer Molecules Inc.),BMI-689 (bismaleimide of dimer diamine, CAS-No. 682800-79-9),4,4′-Diphenylmethanebismaleimide (CAS-No. 13676-54-5),Polyphenylmethanebismaleimide (CAS-No. 28630-26-4),N,N′-(4-methyl-m-phenylene)-bismaleimide (CAS-No. 6422-83-9),N,N′-m-phenylenebismaleimide (CAS-No. 3006-93-7), Prepolymerbismaleimide resins (e.g. Hos-Technik Homide 250 available as CAS-No.26140-67-0), bisphenol A diphenyl ether bismaleimide (CAS-No.79922-55-7), 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethanebismaleimide, (CAS-No. 105391-33-1),N,N′-[Methylenebis(2,6-diethyl-4,1-phenylene)]bis(maleimide) (CAS-No.105357-12-8),N,N′-[Methylenebis(2-isopropyl-6-methyl-4,1-phenylene)]bis(maleimide),1,2-bis(maleimido)ethane (CAS-No. 5132-30-9), 1,4-bis(maleimido)butane(CAS-No. 28537-70-4), and 1,6-bis(maleimido)hexane (CAS-No. 4856-78-5).

In some embodiments, suitable bis-maleimides have the structure depictedby the following examples:

where the R functional groups are independently selected from hydrogen,aromatics, substituted aromatics, aliphatics, substituted aliphatics,cyclo-aliphatics, and substituted cyclo-aliphatics.

Other suitable dienophiles include, but are not limited to, maleicanhydride, derivatives of maleic anhydride, benzoquinone, andderivatives of benzoquinone. Examples of suitable benzoquinonederivatives include 1,4-benzoquinone, 2-methylbenzoquinone,2,3-dimethylbenzoquinone, 2,5-dimethylbenzoquinone,2,6-dimethylbenzoquinone, 2,3,5-trimethylbenzoquinone,2,3,5,6-tetramethylbenzoquinone, and the like and combinations thereof.Examples of suitable maleic derivatives include, but are not limited to,maleic anhydride, methyl maleic anhydride, dimethyl maleic anhydride,maleimide, N-methyl maleimide, N-ethyl maleimide, methyl maleimide,dimethyl maleimide, methyl-N-methyl maleimide, dimethyl-N-methylmaleimide, and the like and combinations thereof.

In some embodiments, the dienophile is a bis-acrylate or an acrylate. Inother embodiments, the dienophile is a dialkyl fumarate, a dialkylmaleate, a dialkylacetylenedicarboxylate. In some embodiments, thedienophile is selected from the group consisting of methyl acrylate,ethyl acrylate, methyl methacrylate, ethyl methacrylate, vinyl acrylate,dimethyl fumarate, dimethyl maleate, diethyl fumarate, diethyl maleate,diphenyl fumarate, divinyl fumarate, divinylmaleate, acrolein, methylvinyl ketone, divinylketone, acrylamide, N,N-dimethyl acrylamide,N,N-dimethyl methacrylamide, N,N-diethyl acrylamide, N,N-diethylacrylamide, acrylonitrile, methacrylonitrile, 1,1-dicyanoethylene,maleonitrile, fiumaronitrile, and tetracyanoethylene. Other acrylatesinclude hexane diol diacrylate and other C₄-C₁₀ alkane diacrylates,bisphenol A diacrylate, pentaerythritol tetraacrylate, propylene glycoldiacrylate, ethylene glycol diacrylate, trimethylol propane triacrylate,cyclohexane dimethanol diacrylate, tricyclodecane dimethanol diacrylate,neopentyl glycol diacrylate, tris(2-hydroxyethyl) isocyanuratetriacrylate, and polybutadiene diacrylate, or the ethoxylated orpropoxylated derivatives thereof. Yet other acrylates include hexanediol di(meth)acrylate and other C₄-C₁₀ alkane di(meth)acrylates,bisphenol A di(meth)acrylate, pentaerythritol tetra(meth)acrylate,propylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate,trimethylol propane tri(meth)acrylate, cyclohexane dimethanoldi(meth)acrylate, tricyclodecane dimethanol d(meth)acrylate, neopentylglycol di(meth)acrylate, tris(2-hydroxyethyl) isocyanuratetri(meth)acrylate, and polybutadiene di(meth)acrylate, or theethoxylated or propoxylated derivatives thereof.

In some embodiments, the present disclosure provides for a reactionproduct between (i) a resin having one of the following structures:

where w and p each are independently an integer ranging from 1 to 150;

and (ii) a dienophile, wherein the dienophile is selected from the groupconsisting of a bis-maleimide, a derivative of a bis-maleimide, a maleicanhydride, a derivative of a maleic anhydride, a benzoquinone, aderivative of a benzoquinone, and an acrylate.

In some embodiments, a composition is provided, the compositioncomprising at least two of the reaction products described above. Insome embodiments, a ratio of a first reaction product to a secondreaction product ranges from about 1:10 to about 10:1. In someembodiments, the ratio ranges from about 1:5 to about 5:1. In someembodiments, the ratio ranges from about 1:2 to about 2:1.

In some embodiments, reaction products between a compound of any ofFormulas (IA) or (IB) and a dienophile have the structure set forth inFormulas (XIA) and (XIB):

wherein

R⁴ and R⁵ are independently —CH— or —C—R¹²;

R⁶ and R⁷ are independently —C(O), —CH₂—, —CH₂—CH₂—, —C(O)CH₂—, or—CH₂—C(O)—;

R⁸ is —C(H), O, N, or S; and

R⁹ is H, a saturated or unsaturated, straight-chain or branched, linearor cyclic, substituted or unsubstituted, aliphatic or aromatic grouphaving between 1 and 40 carbon atoms, R¹⁰—R¹¹, R¹⁰—(R¹³)_(k)—R¹¹, orR¹⁰—(R¹³)_(k)—R¹⁰—R¹¹; or when R⁸ is O or S, R⁹ is one or more pairs ofelectrons;

each R¹⁰ is independently a saturated or unsaturated, straight-chain orbranched, linear or cyclic, substituted or unsubstituted, aliphatic oraromatic group having between 1 and 40 carbon atoms;

R¹¹ has the structure defined by Formula (XIC):

R¹² is F or a C₁-C₄ alkyl group;

R¹³ is a saturated or unsaturated, straight-chain or branched, linear orcyclic, substituted or unsubstituted, aliphatic or aromatic group havingbetween 1 and 50 carbon atoms, and which may be substituted with one ormore heteroatoms selected from O, N, or S;

k is an integer ranging from 1 to 10; and

where

X is a moiety comprising a cyclopentadiene-based ring;

each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;

Z is a bond or straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms;

each m is an integer ranging from 1 to 5;

each n is 0 or 1;

each p is 0 or an integer ranging from 1 to 150;

each r is an integer ranging from 1 to 4;

each s is an integer ranging from 1 to 5;

each w is 0 or an integer ranging from 1 to 150; and

x is 0 or 1.

In some embodiments of the resins of Formulas (XIA) and (XIB), R⁹ or R¹⁰is a straight chain or branched, linear or cyclic, alkyl group havingbetween 1 and 20 carbon atoms, which may be optionally substituted withone or more heteroatoms (e.g. O, N, or S). In some embodiments, R⁹ orR¹⁰ is a moiety having between 1 and 20 carbon atoms and having at leastone aromatic or heteroaromatic group, and where the aromatic orheteroaromatic groups may be substituted or unsubstituted. By way ofexample, one of R⁹ or R¹⁰ may be -phenyl-[C₁-C₄ alkyl group]-phenyl-.

In some embodiments, R¹⁰ comprises -[Aryl]-[Alkyl]-[Aryl], where eacharyl group may be independently substituted or unsubstituted, and wherethe alkyl group comprises between 1 and 20 carbon atoms. In someembodiments, each [Aryl] group is optionally substituted with a C₁-C₁₀straight chain or branched alkyl group.

In some embodiments, R¹⁰ has the structure defined by Formula (XIVa):

wherein each alkyl group is independently straight chain or branched andcomprises between 1 and 10 carbon atoms; and where each h isindependently 0 or an integer ranging from 1 to 4. In some embodiments,each alkyl group independently comprises between 1 and 6 carbon atoms.In some embodiments, each alkyl group independently comprises between 1and 4 carbon atoms. In some embodiments, each alkyl group independentlycomprises between 1 or 2 carbon atoms.

In some embodiments, at least one (Alkyl)_(h) group is —CH₃. In someembodiments, at least one (Alkyl)_(h) group is —CH₂—CH₃. In someembodiments, at least one (Alkyl)_(h) group is —C(H)(CH₃)₂.

In some embodiments, each (Alkyl)_(h) group is —CH₂—CH₃. In someembodiments, each aryl group comprises two (Alkyl)_(h) groups, and each(Alkyl)_(h) group is —CH₂—CH₃.

In some embodiments, each aryl group comprises two (Alkyl)_(h) groups,where a first (Alkyl)_(h) group is —CH₃ and another (Alkyl)_(h) group is—C(H)(CH₃)₂.

In some embodiments, R¹⁰ has the structure

wherein the alkyl group is a straight chain or branched and comprisesbetween 1 and 10 carbon atoms. In some embodiments, the alkyl groupcomprises between 1 and 4 carbon atoms. In some embodiments, the alkylgroup is —CH₂—.

In some embodiments, R¹⁰ is a branched alkyl group comprising between 1and 12 carbon atoms. In some embodiments, R¹⁰ is a branched alkyl groupcomprising between 1 and 10 carbon atoms. In some embodiments, R¹⁰ is abranched alkyl group comprising between 1 and 9 carbon atoms. In someembodiments, R¹⁰ is —CH₂—C(CH₃)₂—CH₂—CH(CH₃)—CH₂—CH₂—.

In some embodiments, R¹⁰ is a 6-membered aromatic ring, optionallysubstituted with up to four alkyl groups.

In some embodiments, R¹⁰ is a six-membered cycloalkyl group, optionallysubstituted with up to four alkyl groups.

In some embodiments, R¹⁰ is -[Alkyl]-[Cycloalkyl]-[Alkyl]-, where eachalkyl group is linear or branched and comprises from 1 to 10 carbonatoms; and where the cycloalkyl group comprises between 4 and 8 carbonatoms, the cycloalkyl group being optionally substituted with one ormore straight chain or branched alkyl groups, each having between 1 and10 carbon atoms.

In some embodiments, reaction products between a compound of any ofFormulas (IA) or (IB) and a dienophile have the structure set forth inFormulas (XID) and (XIE):

wherein

R⁴ and R⁵ are independently —CH— or —C—R¹²;

R⁷ is —C(O), —CH₂—, —CH₂—CH₂—, —C(O)CH₂—, or —CH₂—C(O)—;

R⁸ is —C(H)—, O, N, or S; and

R⁹ is H, a saturated or unsaturated, straight-chain or branched, linearor cyclic, substituted or unsubstituted, aliphatic or aromatic grouphaving between 1 and 40 carbon atoms;

R¹² is F or a C₁-C₄ alkyl group;

X is a moiety comprising a cyclopentadiene-based ring;

each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;

Z is a bond or straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms;

m is an integer ranging from 1 to 5;

n is 0 or 1;

p is 0 or an integer ranging from 1 to 150;

r is an integer ranging from 1 to 4;

s is an integer ranging from 1 to 5; and

w is 0 or an integer ranging from 1 to 150; and

x is 0 or 1.

In some embodiments, reaction products between a compound of any ofFormulas (IA) or (IB) and a dienophile have the structure set forth inFormulas (XIF) and (XIG):

wherein

R⁴ and R⁵ are independently —CH— or —C—R²;

R⁶ and R⁷ each are —C(O)—,

each R⁹ is independently H, a saturated or unsaturated, straight-chainor branched, linear or cyclic, substituted or unsubstituted, aliphaticgroup having between 1 and 40 carbon atoms and optionally substitutedwith O, N, or S;

R¹² is F or a C₁-C₄ alkyl group; and

where

X is a moiety comprising a cyclopentadiene-based ring;

each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;

Z is a bond or straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms;

m is an integer ranging from 1 to 5;

n is 0 or 1;

p is 0 or an integer ranging from 1 to 150;

r is an integer ranging from 1 to 4;

s is an integer ranging from 1 to 5; and

w is 0 or an integer ranging from 1 to 150; and

x is 0 or 1.

In some embodiments, each R⁹ is independently selected from —O-alkyl. Insome embodiments, each R⁹ is independently selected from —O—(C₁-C₂₀)—.In some embodiments, each R⁹ is independently selected from —O—(C₁-C₁₀).In some embodiments, each R⁹ is independently selected from —O—(C₁-C₆).In some embodiments, each R⁹ is independently selected from —O—(C₁-C₄).In some embodiments, each R⁹ is independently selected from —O—(C₁-C₃).

In some embodiments, reaction products between a compound of any ofFormulas (IA) or (IB) and a dienophile have the structure set forth inFormulas (XIIA) or (XIIB):

wherein

R⁴ and R⁵ are independently —CH— or —C—R¹²;

R⁶ and R⁷ are independently —C(O), —CH₂—, —CH₂—CH₂—, —C(O)CH₂—, or—CH₂—C(O)—;

R⁸ is —CH— or —N—;

R¹² is F or a C₁-C₄ alkyl group;

R¹³ is a saturated or unsaturated, straight-chain or branched, linear orcyclic, substituted or unsubstituted, aliphatic or aromatic group havingbetween 1 and 50 carbon atoms, and which may be substituted with one ormore heteroatoms selected from O, N, or S;

R¹⁴ is a saturated or unsaturated, straight-chain or branched, linear orcyclic, substituted or unsubstituted, aliphatic or aromatic group havingbetween 1 and 40 carbon atoms; —(R¹³)_(k)—R¹⁵—, —R¹⁵—(R¹³)_(k)— or—R¹⁵—(R¹³)_(k)—R¹⁵—;

each R¹⁵ is independently a saturated or unsaturated, straight-chain orbranched, linear or cyclic, substituted or unsubstituted, aliphatic oraromatic group having between 1 and 40 carbon atoms;

k is an integer ranging from 1 to 10;

where

X is a moiety comprising a cyclopentadiene-based ring;

each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;

Z is a bond or straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms;

each m is an integer ranging from 1 to 5;

each n is 0 or 1;

each p is 0 or an integer ranging from 1 to 150;

each r is an integer ranging from 1 to 4;

each s is an integer ranging from 1 to 5; and

each w is 0 or an integer ranging from 1 to 150; and

x is 0 or 1.

In some embodiments, R¹⁴ comprises -[Aryl]-[Alkyl]-[Aryl]-, where eacharyl group may be independently substituted or unsubstituted, and wherethe alkyl group comprises between 1 and 20 carbon atoms. In someembodiments, each [Aryl] group is optionally substituted with a C₁-C₁₀straight chain or branched alkyl group.

In some embodiments, R¹⁴ has the structure defined by Formula (XIVa):

wherein each alkyl group is independently straight chain or branched andcomprises between 1 and 10 carbon atoms; and where each h isindependently 0 or an integer ranging from 1 to 4. In some embodiments,each alkyl group independently comprises between 1 and 6 carbon atoms.In some embodiments, each alkyl group independently comprises between 1and 4 carbon atoms. In some embodiments, each alkyl group independentlycomprises between 1 or 2 carbon atoms.

In some embodiments, at least one (Alkyl)_(h) group is —CH₃. In someembodiments, at least one (Alkyl)_(h) group is —CH₂—CH₃. In someembodiments, at least one (Alkyl)_(h) group is —C(H)(CH₃)₂.

In some embodiments, each (Alkyl)_(h) group is —CH₂—CH₃. In someembodiments, each aryl group comprises two (Alkyl)_(h) groups, and each(Alkyl)_(h) group is —CH₂—CH₃.

In some embodiments, each aryl group comprises two (Alkyl)_(h) groups,where a first (Alkyl)_(h) group is —CH₃ and another (Alkyl)_(h) group is—C(H)(CH₃)₂.

In some embodiments, R¹⁴ has the structure

wherein the alkyl group is a straight chain or branched and comprisesbetween 1 and 10 carbon atoms. In some embodiments, the alkyl groupcomprises between 1 and 4 carbon atoms. In some embodiments, the alkylgroup is —CH₂—.

In some embodiments, R¹⁴ is a branched alkyl group comprising between 1and 12 carbon atoms. In some embodiments, R¹⁴ is a branched alkyl groupcomprising between 1 and 10 carbon atoms. In some embodiments, R¹⁴ is abranched alkyl group comprising between 1 and 9 carbon atoms. In someembodiments, R¹⁴ is —CH₂—C(CH₃)₂—CH₂—CH(CH₃)—CH₂—CH₂—.

In some embodiments, R¹⁴ is a six-membered cycloalkyl group, optionallysubstituted with up to four alkyl groups. In some embodiments, R¹⁴ is asix-membered cycloalkyl group, optionally substituted with up to four—CH₃ groups. In some embodiments, R¹⁴ is a six-membered cycloalkylgroup, optionally substituted with up to two —CH₃ groups.

In some embodiments, R¹⁴ is a six-membered cycloalkyl group, optionallysubstituted with up to four alkyl groups.

In some embodiments, R¹⁴ is -[Alkyl]-[Cycloalkyl]-[Alkyl]-, where eachalkyl group is linear or branched and comprises from 1 to 10 carbonatoms; and where the cycloalkyl group comprises between 4 and 8 carbonatoms, the cycloalkyl group being optionally substituted with one ormore straight chain or branched alkyl groups, each having between 1 and10 carbon atoms.

In another aspect of the present disclosure is a composition comprisinga blend of one or more compounds of any of Formulas (XIIA) or (XIIB). Insome embodiments, a ratio of a first compound of any of Formulas (XIIA)or (XIIB) to a second compound of any of any of Formulas (XIIA) or(XIIB) ranges from about 1:10 to about 10:1. In some embodiments, theratio ranges from about 1:5 to about 5:1. In some embodiments, the ratioranges from about 1:2 to about 2:1.

In some embodiments, reaction products between a compound of any ofFormulas (IA) or (IB) and a dienophile have the structure set forth inFormulas (XIIC) or (XIID):

wherein

R¹³ is a saturated or unsaturated, straight-chain or branched, linear orcyclic, substituted or unsubstituted, aliphatic or aromatic group havingbetween 1 and 50 carbon atoms, and which may be substituted with one ormore heteroatoms selected from O, N, or S;

R¹⁴ is a saturated or unsaturated, straight-chain or branched, linear orcyclic, substituted or unsubstituted, aliphatic or aromatic group havingbetween 1 and 40 carbon atoms; —(R¹³)_(k)—R¹⁵—, —R¹⁵—(R¹³)_(k)— or—R¹⁵—(R¹³)_(k)—R¹⁵—;

each R¹⁵ is independently a saturated or unsaturated, straight-chain orbranched, linear or cyclic, substituted or unsubstituted, aliphatic oraromatic group having between 1 and 40 carbon atoms;

k is an integer ranging from 1 to 10;

where

X is a moiety comprising a cyclopentadiene-based ring;

each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;

Z is a bond or straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms;

each m is an integer ranging from 1 to 5;

each n is 0 or 1;

each p is 0 or an integer ranging from 1 to 150;

each r is an integer ranging from 1 to 4;

each s is an integer ranging from 1 to 5; and

each w is 0 or an integer ranging from 1 to 150; and

x is 0 or 1.

In some embodiments, R¹⁴ is comprises -[Aryl]-[Alkyl]-[Aryl]-, whereeach aryl group may be independently substituted or unsubstituted, andwhere the alkyl group comprises between 1 and 20 carbon atoms. In someembodiments, each [Aryl] group is optionally substituted with a C₁-C₁₀straight chain or branched alkyl group.

In some embodiments, R¹⁴ has the structure defined by Formula (XIVa):

wherein each alkyl group is independently straight chain or branched andcomprises between 1 and 10 carbon atoms; and where each h isindependently 0 or an integer ranging from 1 to 4. In some embodiments,each alkyl group independently comprises between 1 and 6 carbon atoms.In some embodiments, each alkyl group independently comprises between 1and 4 carbon atoms. In some embodiments, each alkyl group independentlycomprises between 1 or 2 carbon atoms.

In some embodiments, at least one (Alkyl)_(h) group is —CH₃. In someembodiments, at least one (Alkyl)_(h) group is —CH₂—CH₃—. In someembodiments, at least one (Alkyl)_(h) group is —C(H)(CH₃)₂.

In some embodiments, each (Alkyl)_(h) group is —CH₂—CH₃. In someembodiments, each aryl group comprises two (Alkyl)_(h) groups, and each(Alkyl)_(h) group is —CH₂—CH₃.

In some embodiments, each aryl group comprises two (Alkyl)_(h) groups,where a first (Alkyl)_(h) group is —CH₃ and another (Alkyl)_(h) group is—C(H)(CH₃)₂.

In some embodiments, R¹⁴ has the structure

wherein the alkyl group is a straight chain or branched and comprisesbetween 1 and 10 carbon atoms. In some embodiments, the alkyl groupcomprises between 1 and 4 carbon atoms. In some embodiments, the alkylgroup is —CH₂—.

In some embodiments, R¹⁴ is a branched alkyl group comprising between 1and 12 carbon atoms. In some embodiments, R¹⁴ is a branched alkyl groupcomprising between 1 and 10 carbon atoms. In some embodiments, R¹⁴ is abranched alkyl group comprising between 1 and 9 carbon atoms. In someembodiments, R¹⁴ is —CH₂—C(CH₃)₂—CH₂—CH(CH₃)—CH₂—CH₂—.

In some embodiments, R¹⁴ is a six-membered cycloalkyl group, optionallysubstituted with up to four alkyl groups. In some embodiments, R¹⁴ is asix-membered cycloalkyl group, optionally substituted with up to four—CH₃ groups. In some embodiments, R¹⁴ is a six-membered cycloalkylgroup, optionally substituted with up to two —CH₃ groups.

In some embodiments, R¹⁴ is a six-membered cycloalkyl group, optionallysubstituted with up to four alkyl groups.

In some embodiments, R¹⁴ is -[Alkyl]-[Cycloalkyl]-[Alkyl]-, where eachalkyl group is linear or branched and comprises from 1 to 10 carbonatoms; and where the cycloalkyl group comprises between 4 and 8 carbonatoms, the cycloalkyl group being optionally substituted with one ormore straight chain or branched alkyl groups, each having between 1 and10 carbon atoms.

In some embodiments, reaction products between a compound of any ofFormulas (IA) or (IB) and a dienophile have the structure set forth inFormula (XIIE):

wherein

R¹³ is a saturated or unsaturated, straight-chain or branched, linear orcyclic, substituted or unsubstituted, aliphatic or aromatic group havingbetween 1 and 50 carbon atoms, and which may be substituted with one ormore heteroatoms selected from O, N, or S;

R¹⁴ is a saturated or unsaturated, straight-chain or branched, linear orcyclic, substituted or unsubstituted, aliphatic or aromatic group havingbetween 1 and 40 carbon atoms; —(R¹³)_(k)—R¹⁵—, —R¹⁵—(R¹³)_(k)— or—R¹⁵—(R¹³)_(k)—R¹⁵—;

each R¹⁵ is independently a saturated or unsaturated, straight-chain orbranched, linear or cyclic, substituted or unsubstituted, aliphatic oraromatic group having between 1 and 40 carbon atoms;

k is an integer ranging from 1 to 10;

B is H or X(A)_(s);

X is a moiety comprising a cyclopentadiene-based ring;

each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;

Z is a bond or straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms;

each m is an integer ranging from 1 to 5;

each n is 0 or 1;

each q is 0 or 1; and

each s is an integer ranging from 1 to 5.

In some embodiments, R¹⁴ is comprises -[Aryl]-[Alkyl]-[Aryl]-, whereeach aryl group may be independently substituted or unsubstituted, andwhere the alkyl group comprises between 1 and 20 carbon atoms. In someembodiments, each [Aryl] group is optionally substituted with a C₁-C₁₀straight chain or branched alkyl group.

In some embodiments, R¹⁴ has the structure defined by Formula (XIVa):

wherein each alkyl group is independently straight chain or branched andcomprises between 1 and 10 carbon atoms; and where each h isindependently 0 or an integer ranging from 1 to 4. In some embodiments,each alkyl group independently comprises between 1 and 6 carbon atoms.In some embodiments, each alkyl group independently comprises between 1and 4 carbon atoms. In some embodiments, each alkyl group independentlycomprises between 1 or 2 carbon atoms. In some embodiments, at least one(Alkyl)_(h) group is —CH₃. In some embodiments, at least one (Alkyl)_(h)group is —CH₂—CH₃. In some embodiments, at least one (Alkyl)_(h) groupis —C(H)(CH₃)₂. In some embodiments, each (Alkyl)_(h) group is —CH₂—CH₃.In some embodiments, each aryl group comprises two (Alkyl)_(h) groups,and each (Alkyl)_(h) group is —CH₂—CH₃. In some embodiments, each arylgroup comprises two (Alkyl)_(h) groups, where a first (Alkyl)_(h) groupis —CH₃ and another (Alkyl)_(h) group is —C(H)(CH₃)₂.

In some embodiments, R¹⁴ has the structure

wherein the alkyl group is a straight chain or branched and comprisesbetween 1 and 10 carbon atoms. In some embodiments, the alkyl groupcomprises between 1 and 4 carbon atoms. In some embodiments, the alkylgroup is —CH₂—.

In some embodiments, R¹⁴ is a branched alkyl group comprising between 1and 12 carbon atoms. In some embodiments, R¹⁴ is a branched alkyl groupcomprising between 1 and 10 carbon atoms. In some embodiments, R¹⁴ is abranched alkyl group comprising between 1 and 9 carbon atoms. In someembodiments, R¹⁴ is —CH₂—C(CH₃)₂—CH₂—CH(CH₃)—CH₂—CH₂—.

In some embodiments, R¹⁴ is a 6-membered aromatic ring, optionallysubstituted with up to four alkyl groups.

In some embodiments, R¹⁴ is a six-membered cycloalkyl group, optionallysubstituted with up to four alkyl groups. In some embodiments, R¹⁴ is asix-membered cycloalkyl group, optionally substituted with up to four—CH₃ groups. In some embodiments, R¹⁴ is a six-membered cycloalkylgroup, optionally substituted with up to two —CH₃ groups.

In some embodiments, R¹⁴ is -[Alkyl]-[Cycloalkyl]-[Alkyl]-, where eachalkyl group is linear or branched and comprises from 1 to 10 carbonatoms; and where the cycloalkyl group comprises between 4 and 8 carbonatoms, the cycloalkyl group being optionally substituted with one ormore straight chain or branched alkyl groups, each having between 1 and10 carbon atoms.

In some embodiments, R¹⁴ is -[Aryl]-(R¹³)_(k)-[Aryl]-, where each arylgroup may be independently substituted or unsubstituted. In someembodiments, each -[Aryl]- group is optionally substituted with a C₁-C₁₀straight chain or branched alkyl group. In some embodiments, each-[Aryl]- group is unsubstituted.

In some embodiments, R¹⁴ is -[alkyl]-(R¹³)_(k)—, where the alkyl groupmay comprises between 1 and 40 carbon atoms. In some embodiments, R¹⁴ is-[alkyl]-[cycloalkyl]-[alkyl]-(R¹³)_(k)—, the cycloalkyl groupcomprising between 4 and 8 carbon atoms, the cycloalkyl group beingoptionally substituted with one or more straight chain or branched alkylgroups, each having between 1 and 10 carbon atoms.

In some embodiments, R¹³ comprises a moiety including a substitutedphenyl group.

In some embodiments, reaction products between a compound of any ofFormulas (IA) or (IB) and a dienophile have the structure set forth inFormula (XIIF):

wherein

each R¹⁶ is independently H or a substituted or unsubstituted, linear orbranched, linear or cyclic alkyl group having between 1 and 10 carbonatoms;

B is H or X(A)_(s);

X is a moiety comprising a cyclopentadiene-based ring;

each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;

Z is a bond or straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms;

each m is an integer ranging from 1 to 5;

each n is 0 or 1;

each q is 0 or 1; and

each s is an integer ranging from 1 to 5.

In some embodiments, each R¹⁶ is independently H or a C₁-C₄ alkyl group.

In some embodiments, reaction products between a compound of any ofFormulas (IA) or (IB) and a dienophile have the structure set forth inFormula (XIII):

wherein

X is a moiety comprising a cyclopentadiene-based ring;

each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;

Z is a bond or straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms;

each m is an integer ranging from 1 to 5;

each n is 0 or 1;

each p is 0 or an integer ranging from 1 to 150;

each r is an integer ranging from 1 to 4; and

w is 0 or an integer ranging from 1 to 150; and

x is 0 or 1.

In some embodiments of the compounds of Formula (XIII), one of w or p is0. In other embodiments, w and p are both 0.

Specific examples of the reaction products of a resin of any of Formulas(IA) or (IB) and a dienophile are illustrated within the syntheticexamples herein.

Synthesis of the Compounds of Any of Formulas (XIA), (XIB), (XID) to(XIG), (XIIA) to (XIIF), and (XIII)

In some embodiments, the compounds of Formulas (XIA), (XIB), (XID) to(XIG), (XIIA) to (XIIF), and (XIII) may be prepared by neat blendingcombination of resins of Formulas (IA) or (IB) with one or more suitabledienophiles, including those described herein. In other embodiments,compounds of Formulas (XIA), (XIB), (XID) to (XIG), (XIIA) to (XIIF),and (XIII) may be prepared by combination of resins of Formula (IA) or(IB) with one or more suitable dienophiles in an organic solvent atmoderate temperatures (typically between 0° C. and 100° C.). Reactionsbetween resins of Formulas (IA) or (IB) and suitable dienophiles aretypically rapid and self-initiating, and compounds of Formulas (XIA),(XIB), (XID) to (XIG), (XIIA) to (XIIF), and (XIII) can be usedas-generated, or purified by removal of reaction solvent in vacuo asdesired.

In some embodiments, an excess of diene is used compared to an amount ofdienophile. In other embodiments, a ratio of an amount of diene todienophile ranges from about 1:1 to about 1:4. In other embodiments, aratio of an amount of diene to dienophile ranges from about 1:1 to about1:2.

In some embodiments, the compounds of Formulas (XIA), (XIB), (XID) to(XIG), (XIIA) to (XIIF), and (XIII) may be prepared according to themethods outlined in the following non-limiting synthetic schemes:

where R is R¹⁴ as defined herein.

where n is an integer ranging from 1 to 10.

where n is an integer ranging from 1 to 10.

Polymers, Copolymers, and Blends of Resins

In some embodiments, a polymer is provided, the polymer being derivedfrom one or more resins of Formulas (IA) or (IB) (or any like resindisclosed herein). In some embodiments, the at least one of the resinsof Formulas (IA) or (IB) comprises at least one A moiety terminating inone of a —CH═CH₂ group, a —CH═CH—CH₃, or alkyne group. In someembodiments, the polymer further comprises an additive selected from thegroup consisting of adhesion agents, peroxides/crosslinking agents,antioxidants, flame retardants, diluents and fillers.

In some embodiments, a co-polymer is provided, the co-polymer derivedfrom a first resin of Formulas (IA) or (IB) and a second resin ofFormulas (IA) or (IB), wherein the first and second resins aredifferent. In some embodiments, an interpenetrating polymer network isprovided, the interpenetrating polymer network derived from a firstresin of Formulas (IA) or (IB) and a second resin of Formulas (IA) or(IB), wherein the first and second resins are different.

In some embodiments, a co-polymer or an interpenetrating polymer networkis provided, the co-polymer or the interpenetrating polymer networkbeing derived from a resin of Formulas (IA) or (IB), and a secondcomponent that differs from the resin of Formulas (IA) or (IB). In someembodiments, the second component is selected from the group consistingof polyethylenes, polypropylenes, polybutylenes, low vinylpolybutadienes (predominantly 1,3 addition), high vinyl polybutadienes(significant 1,2 addition), polystyrenes, butadiene-styrene copolymers,SMA polymers, ABS polymers, polydicyclopentadienes, epoxies,polyurethanes, cyanate esters, poly(phenylene oxide), EPDM polymers,cyclic olefin copolymers (COC), polyimides, bismaleimides, phosphazenes,olefin-modified phosphazenes, acrylates, vinyl esters, polylactones,polycarbonates, polysulfones, polythioethers, polyetheretherketones(PEEK), polydimethylsiloxanes (PDMS), polyethylene terephthalates (PET),polybutylene terephthalates (PBT), and other commercially-availablepolymers. In some other embodiments, the second component is selectedfrom the group consisting of styrene, divinylbenzene,1,2-bis(vinylphenyl)ethane, vinylbenzyl ether compounds, vinyl ethercompounds, allyl ether compounds, vinylphenyl monomers, vinyl monomers,allyl monomers, or derivatives of such components. Suitable componentsinclude, but are not limited to, vinyl-functionalized cyanate esterHTL-300 (available from Lonza Chemicals), low- and high-vinyl Riconpolybutadienes (Total/Cray Valley), butadiene-styrene Ricon copolymers(Total/Cray Valley), Sartomer acrylate monomers (Arkema),olefin-containing phosphazene SPV-100 (Otsuka Chemicals), bismaleimideBMPI-300 (Lonza Chemicals), bismaleimide Cycom 5250 (Cytec Solvay),bismaleimide BMI-1700 (Designer Molecules Inc.), bismaleimide BMI-3000(Designer Molecules, Inc.), bismaleimide BMI-689 (Designer Molecules,Inc.), bismaleimide Homide 250 (HOS-Technik GmbH), bismaleimide BMI-2300(Daiwakaskei Industry Co., LTD), bismaleimide BMI-TMH (DaiwakaskeiIndustry Co., LTD), bismaleimide Compimide 353A (Evonik), bismaleimideCompimide C796 (Evonik), methacrylate-functionalized polyphenylene etherSA9000 (Sabic, Saudi Basic Industries Corporation), functionalizedphenylene ether oligomers OPE-2EA and OPE-2St (MGC, Mitsubishi GasCompany), polyimide PETI 330 (UBE Industries, Ltd), Vinyl-ester resinsAdvalite 35070-00 (Reichhold), epoxy resins Celloxide 8000 and Celloxide2021P (Daicel) or Araldite MY 721 and GY 281 and GY 240 (Huntsman).

Resin compositions of the present disclosure can be used as-isolated, orin blends with other copolymers, adhesion agents, peroxides/crosslinkingagents, antioxidants, flame retardants, diluents and other additives orfillers known in the art.

As will be appreciated by those of ordinary skill in the art, the resinsdisclosed herein may be blended with other polymers. Such other polymersmay be reactive such that they are copolymerized with the resincompositions of the present disclosure to form random or blockcopolymers. Alternately such other polymers may be formed by alternatemeans such that an interpenetrating polymer network or polymer phasedispersion is formed. Such other polymers include but are not limited topolyethylenes, polypropylenes, polybutylenes, low vinyl polybutadienes(predominantly 1,3 addition), high vinyl polybutadienes (significant 1,2addition), polystyrenes, butadiene-styrene copolymers, SMA polymers(styrene maleic anhydride polymers), ABS polymers (acrylonitrilebutadiene styrene polymers), polydicyclopentadienes, epoxies,polyurethanes, cyanate esters, poly(phenylene oxide), EPDM polymers(polymers derived from ethylene propylene diene monomers), cyclic olefincopolymers (COC), polyimides, bismaleimides, phosphazenes,olefin-modified phosphazenes, acrylates, vinyl esters, polylactones,polycarbonates, polysulfones, polythioethers, polyetheretherketones(PEEK), polydimethylsiloxanes (PDMS), polyethylene terephthalates (PET),polybutylene terephthalates (PBT), and other commercially-availablepolymers. Such polymers may be optionally modified or functionalized asdesired.

In some embodiments, the resins disclosed herein may be blended with anelectrical property modifier. Examples of the electrical propertymodifier may include cyanate ester derived compounds and bismaleimidetriazine copolymers. A cyanate ester derived compound broadly refers toa chemical substance generally based on a bisphenol or novolacderivative, in which the hydrogen atom of at least one hydroxyl group ofthe bisphenol or novolac derivative is substituted by a cyanide group.Therefore, a cyanate ester derived compound generally has an —OCN group.In some implementations, a cyanate ester derived compound may refer to,without limitation, 4,4′-ethylidenebisphenylene cyanate,4,4′-dicyanatodiphenyl, 2,2-bis(4-cyanatophenyl)propane,bis(4-cyanato-3,5-dimethylphenyl)methane, bis(4-cyanatophenyl)thioether,bis(4-cyanatophenyl)ether, prepolymer of bisphenol A dicyanate in methylethyl ketone, 1,1-bis(4-cyanatophenyl)ethane,1,1-bis(4-cyanatophenyl)methane,1,3-bis(4-cyanatophenyl-1-(methylethylidene))benzene,bis(4-cyanatophenyl)ether, bis(4-cyanatophenyl)-2,2-butane,1,3-bis[2-(4-cyanato phenyl)propyl]benzene, tris(4-cyanatophenyl)ethane,cyanated novolac, and cyanated phenoldicyclopentadiene adduct.

Resins of the present disclosure may be blended with various additivesand adhesion agents to improve resin adhesion and compatibility withreinforcement substrates such as glass, carbon or aramid fibers.Suitable adhesion promoting additives include but are not limited tomaleic anhydride, styrene maleic anhydrides, functionalizedtrialkoxysilanes, maleic anhydride-grafted polyolefins, as well as otherpolymers previously detailed in this disclosure which are capable ofimproved substrate adhesion.

Resin compositions of the present disclosure may be cured into a solidmaterial by self-polymerization reactions at elevated temperatures, orby action of added radical initiators. Suitable radical initiatorsinclude but are not limited to dialkyl peroxides, diacyl peroxides, andazo compounds. Particularly suitable radical initiators include dicumylperoxide and 2,5-Dimethyl-2,5-di-(tert-butylperoxy)hexyne-3 (Trigonox145-E85). Radical initiators may be added at any level suitable toeffect sufficient polymerization, ranging from ppm levels to 3 wt %depending on initiator used. If a radical initiator is used, it may beused in an amount ranging from about 0.5% to about 1.5% by weight of thecomposition.

Resin compositions of the present disclosure can be cured into a solidmaterial at temperatures ranging from between about 120° C. to about200° C. for between about 30 minutes and about 240 minutes. In someembodiments, the resin compositions may be cured into a solid materialat temperatures ranging from between about 150° C. to about 175° C. forbetween about 60 minutes and about 180 minutes. The disclosure can thenoptionally be heated to higher temperatures for additional polymercuring as desired. In some embodiments, the resins of this disclosure,when fully cured, generate solid thermoset materials that possess glasstransition temperatures (Tg) greater than 100° C. In some embodiments,the resins of this disclosure, when fully cured, generate solidthermoset materials that possess glass transition temperatures (Tg)greater than 150° C. In some embodiments, the resins of this disclosure,when fully cured, generate solid thermoset materials that possess glasstransition temperatures (Tg) greater than 200° C. In some embodiments,the resins of this disclosure, when fully cured, generate solidthermoset materials that possess glass transition temperatures (Tg)ranging from about 100° C. to about 400° C. In yet other embodiments,the resins of this disclosure, when fully cured, generate solidthermoset materials that possess glass transition temperatures (Tg)ranging from about 125° C. to about 400° C. In yet other embodiments,the resins of this disclosure, when fully cured, generate solidthermoset materials that possess glass transition temperatures (Tg)ranging from about 175° C. to about 400° C.

Mechanical properties of the polymerized resin compositions of thepresent disclosure may be modified by incorporation of crosslinkingagents. Such crosslinking agents include but are not limited to triallylcyanurate, triallyl isocyanurate, polybutadiene dimethacrylates,polybutadiene diacrylates, divinylbenzene, 1,2-bis(vinylphenyl)ethane,vinylbenzyl ether compounds, vinyl ether compounds, allyl ethercompounds, vinylphenyl monomers, vinyl monomers, allyl monomers, andsimilar compounds containing two or more carbon-carbon bond formingmoieties per molecule.

Resin compositions of the present disclosure may be blended withsolvents prior to polymerization, if desired, for certain applications.Any solvent known by one with skill in the art to be useful inconjunction with resin composition can be used. Particularly usefulsolvents include methyl ethyl ketone (MEK), xylene, toluene, DMF, andmixtures thereof. In some embodiments, the solvents are selected fromMEK or toluene. When used, solvents are present in the resin compositionin the amount ranging from between about 1% to about 99% by weight ofthe composition. In other embodiments, solvents are present in the resincomposition in an amount ranging from between about 10% and about 60% byweight of the composition. In other embodiments, solvents are present inthe resin composition in an amount ranging from between about 15% andabout 30% by weight of the composition. In yet other embodiments,solvents are present in the resin composition in an amount ranging frombetween about 20% to about 25% by weight of the composition. Suchsolvent-blended resin compositions of the present disclosure are mostuseful for production of prepreg-style reinforcement layers.

The thermosetting resin compositions of the present disclosure mayadditionally be formulated with other standard antioxidants, flameretardants, fillers, diluents, stabilizers, processing aids and otheradditives as are commonly used in such applications. Such additivesinclude, but are not limited to, phenolic antioxidants, dielectricfillers and commercial flame retardants. Most commercial flameretardants are suitable for use with resins of the present disclosure.Suitable flame retardants also include phosphazenes and olefin-modifiedphosphazenes. Also, resin laminates made from resin composition can bemade V0 without halogenated flame retardant using reactive phosphorusflame retardants such as (vinyl or other radical-reactive FR), as wellas non-reactive phosphorus flame retardants.

The thermosetting resin compositions of the subject disclosure may alsobe used to provide prepregs with and without tack. The compositions areparticularly useful in preparation of high Tg laminates having ultra-lowdielectric constants and ultra-low dielectric loss. These electricalproperties help solve signal speed and signal integrity problemsencountered with high-speed analog and digital circuitry applications.The thermosetting resin compositions of the subject disclosure areuseful for making prepregs in a continuous process with and withoutsolvent. The viscosity of the inventive compositions can be adjusted forhot/melt prepreg and present substantial cost savings for prepregproduction. Prepregs are generally manufactured using a reinforcementmaterial including but not limited to woven glass, carbon, Kevlar,spectra, aramid or quartz fibers. The thermosetting resin composition ofthe present disclosure may also be coated directly to any polymeric filmfor build-up PCB. Thermosetting resin compositions of the presentdisclosure may also be directly coated to copper using slot-die or otherrelated coating techniques for resin-coated copper (RCC). The prepregmaterials made from thermosetting resins of the present disclosure canalso be converted to laminates. The lamination process typically followsthe stack-up of one or more prepreg layers between one or more sheets ofconductive foil such as copper foil. This process is often described ascopper-clad laminates (CCL) and is generally well-known to persons withordinary skill in the art. Pressure and temperature applied to theprepreg stack result in the formation of laminates. The laminatesproduced from the present disclosure exhibit high Tg. It is alsopossible to generate compositions of the present disclosure that producelaminates of moderate Tg (>150° C.) with considerable flexibility.Flexible laminates are very useful for various bendable electronicdevices. Thermosetting resins of the present disclosure withsufficiently low viscosities may also be used for vacuum infusionapplications, where reinforcement materials as previously defined areimpregnated with resin formulations of the present disclosure by actionof vacuum pressure. Resins of the present disclosure with sufficientlylow viscosities may be used in solvent-less or environmentally friendlymanufacturing techniques for various applications. Resins of the presentdisclosure may also be used in 3D printing applications, includingcontinuous liquid interface printing (CLIP) and stereolithography (SLA)applications.

Such combinations allow for improved surface adhesion performance incoatings, adhesives, composites and laminates.

Resins of Formulas (IA) or (IB) may additionally be used as additives,reactive diluents, or copolymers for commercial polymers used inelectronic applications, providing improvements in resin viscosity anddielectric properties. In some embodiments, resins of Formulas (IA) or(IB) may be combined with resins based on cyanate esters, epoxies,bismaleimides, or polyolefins to generate blends with improvedmanufacturing properties, mechanical performance, or electricalperformance.

Kits

In another aspect of the present disclosure are kits comprising any ofthe resins, polymers, blends, etc. disclosed herein. In someembodiments, the resins, polymers, blends, etc. are mixed with asuitable solvent. In some embodiments, the kits comprise multipleresins, polymers, blends, etc., where each of the resins, polymers,blends, etc. are provided in a separate container. In some embodiments,the kits include a resin and other reactants, reagents, or solvents. Insome embodiments, the kits further comprise instructions.

For example, a kit may include a resin of any of Formulas (IA) or (IB)and also may include a bis-maleimide, such that the resin and thebis-maleimide may be reacted to form a product. Any bis-maleimides maybe included in a kit, including any of those recited herein. In someembodiments, the kit includes a bis-maleimide is selected from the groupconsisting of 1,6′-bismaleimide-(2,2,4-trimethyl)hexane,4,4′-Diphenylmethanebismaleimide, Polyphenylmethanebismaleimide,N,N′-(4-methyl-m-phenylene)-bismaleimide, N,N′-m-phenylenebismaleimide,bisphenol A diphenyl ether bismaleimide,3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide,N,N′-[Methylenebis(2,6-diethyl-4,1-phenylene)]bis(maleimide,N,N′-[Methylenebis(2-isopropyl-6-methyl-4,1-phenylene)]bis(maleimide),1,2-bis(maleimido)ethane, 1,4-bis(maleimido)butane, and1,6-bis(maleimido)hexane.

In some embodiments, a kit may include a resin of any of Formulas (IA)or (IB) and also may include a crosslinking agent, such as acrosslinking agent selected from the group consisting of triallylcyanurate, triallyl isocyanurate, polybutadiene dimethacrylates,polybutadiene diacrylates, divinylbenzene, 1,2-bis(vinylphenyl)ethane,vinylbenzyl ether compounds, vinyl ether compounds, allyl ethercompounds, vinylphenyl monomers, vinyl monomers, and allyl monomers.

Applications

The resins, reaction products, blends, polymers, compositions, etc.described herein may be utilized in any suitable application. Forexample, the resins, reaction products, blends, polymers, compositions,etc. may be used as a substrate onto which other materials may beapplied. In some embodiments, resins, reaction products, blends,polymers, compositions, etc. may be applied as films onto the surface ofanother substrate or a laminate may be produced from the resins,reaction products, blends, polymers, compositions, etc. disclosedherein.

In some embodiments, the resins, reaction products, blends, polymers,compositions, etc. disclosed herein may be used in the manufacture ofprinted circuit boards or for general use in any electronic device. Inother embodiments, resins, reaction products, blends, polymers,compositions, etc. disclosed herein may be used in radomes, antennas(e.g. cellular phone antennas, satellite phone antennas, antennas for 5Gcommunication devices, etc.), or in radar structures. In yet otherembodiments, the resins, reaction products, blends, polymers,compositions, etc. disclosed herein may be used as part of an under filladhesive composition. In further embodiments, the resins, reactionproducts, blends, polymers, compositions, etc. disclosed herein may beused in cellular base stations, wireless base stations, modems, androuters. In yet other embodiments, the resins, reaction products,blends, polymers, compositions, etc. disclosed herein may be used inradio frequency identification tags and other sensors. In yet otherembodiments, the resins, reaction products, blends, polymers,compositions, etc. disclosed herein may be used in microwavecommunication systems. In yet other embodiments, the resins, reactionproducts, blends, polymers, compositions, etc. disclosed herein may beused communications and network servers. In yet other embodiments, theresins, reaction products, blends, polymers, compositions, etc.disclosed herein may be used in backplanes.

EXAMPLES

Materials:

Sodium hydride (60% dispersion in mineral oil) was obtained fromSigma-Aldrich. Cyclopentadiene was isolated by thermal cracking ofdicyclopentadiene (Ultrene 97 from Cymetech Corporation) at temperaturesof 150-180° C. per literature methods. Vinylbenzyl chloride was obtainedfrom DOW Chemical Company and used as received. Allyl chloride,1,3-dibromopropane, 1,6-dichlorohexane, divinylbenzene, and glycidylmethacrylate were obtained from Sigma Aldrich and used as received.Maleic anhydride was obtained from Huntsman and used as-received. Methyltributyl ammonium chloride was obtained from Sachem, Inc. Trigonox145-E85 was obtained from Akzo Nobel. HTL-300 was obtained from Lonza.Novocure 200 was obtained from Novoset LLC. Ricon 153 and Ricon 100 wereobtained from Total/Cray Valley. Sartomer CN-301 and Sartomer CN-303were obtained from Arkema. Noryl SA-9000 was obtained from Sabic.BMPI-300 was obtained from Cyalume Specialty Products. BMI-3000 andBMI-689 were obtained from Designer Molecules, Inc. BMI-TMH and BMI-2300were obtained from Daiwakasei Industry Co.4,4′-diphenylmethanebismaleimide was obtained from Chem-ImpexInternational. Homide 250 was obtained from HOS-Technik. TAICROS,Compimide 353A, Compimide C796, Dynasylan MEMO, and Dynasylan VTEO wereobtained from Evonik.

Synthesis Example 1

In a 500 mL round-bottomed flask, 16.7 g sodium hydride dispersion (60%in mineral oil, 1.1 equivalents active sodium hydride) was washed withhexanes to remove the mineral oil and then suspended in 250 mL oftetrahydrofuran (THF). The reaction vessel was filled with inertatmosphere and cooled to 0° C. Freshly-cracked cyclopentadiene (26.0 g,1.0 equivalent) was added portion wise with vigorous stirring,generating hydrogen gas that was vented. After all cyclopentadiene wasadded, the reaction was heated to mild reflux (60° C.) and vinylbenzylchloride (52.0 g, 0.9 eq) was added portion-wise, after which thereaction was maintained at reflux for an additional 30 minutes beforeaddition of water (50 g) to eliminate any unreacted hydride. The THFsolvent was removed by rotary evaporation, yielding an organic/aqueousmixture. The organic phase was diluted with a mix of xylenes and hexane(50 vol %) and washed several times with aqueous HCl (10 wt %) solutionand water before isolation of the organic phase. The organic phase wasdried over sodium sulfate and the solvents were removed by vacuumdistillation, yielding a product mixture featuring cyclopentadienessubstituted with one or more vinylbenzyl substituents.

Synthesis Example 2

Following the procedure in Example 1, NaH (2.2 eq) was combined withfreshly-cracked cyclopentadiene (1.0 eq) and vinylbenzyl chloride (2.0eq) to yield a product mixture featuring cyclopentadienes substitutedwith an average of two vinylbenzyl substituents.

Synthesis Example 3

Following the procedure in Example 1, NaH (2.2 eq) was combined withfreshly-cracked cyclopentadiene (2.0 eq) and 1,3-dibromopropane (1.0 eq)to yield a product mixture featuring an average of two cyclopentadienesconnected by a propyl hydrocarbon.

Synthesis Example 4

Following the procedure in Example 1, NaH (2.2 eq) was combined withfreshly-cracked cyclopentadiene (2.0 eq) and 1,6-dichlorohexane (1.0 eq)to yield a product mixture featuring an average of two cyclopentadienesconnected by a hexyl hydrocarbon.

Synthesis Example 5

Following a modified procedure, cyclopentadiene compounds (1.0 eq) asdescribed in Synthesis Example 4 were added portion wise to a suspensionof NaH (2.2 eq) in THF with vigorous stirring, generating hydrogen gasthat was vented. After all cyclopentadiene compounds were added, thereaction was heated to mild reflux (60° C.) and vinylbenzyl chloride(2.0 eq) was added portion-wise, after which the reaction was maintainedat reflux for an additional 30 minutes before addition of water (50 g)to eliminate any unreacted hydride. Following workup as described inSynthesis Example 1, the reaction yielded a product mixture featuring anaverage of two (vinylbenzyl)-functionalized cyclopentadienes connectedby a hexyl hydrocarbon.

Synthesis Example 6

Following a modified procedure, NaH (4.4 eq) was combined withfreshly-cracked cyclopentadiene (2.0 eq), and 1,6-dichlorohexane (1.0eq), followed by addition of vinylbenzyl chloride (2.0 eq), after whichthe reaction was maintained at reflux for an additional 30 minutesbefore addition of water (50 g) to eliminate any unreacted hydride.Following workup as described in Synthesis Example 1, the reactionyielded a product mixture featuring an average of two(vinylbenzyl)-functionalized cyclopentadienes connected by a hexylhydrocarbon.

Synthesis Example 7

Following a modified procedure, NaH (5.5 eq) was combined withfreshly-cracked cyclopentadiene (2.0 eq), and 1,6-dichlorohexane (1.5eq), followed by addition of vinylbenzyl chloride (2.0 eq). Afteraddition, the reaction was maintained at reflux for an additional 30minutes before addition of water (50 g) to eliminate any unreactedhydride. Following workup as described in Synthesis Example 1, thereaction yielded a product mixture featuring oligomers of(vinylbenzyl)-functionalized cyclopentadienes connected by hexylhydrocarbons.

Synthesis Example 8

Following a modified procedure, NaH (4.4 eq) was combined withfreshly-cracked cyclopentadiene (2.0 eq), and 1,6-dichlorohexane (1.0eq), followed by addition of a mixture of vinylbenzyl chloride (1.0 eq)and allyl chloride (1.0 eq). After addition, the reaction was maintainedat reflux for an additional 30 minutes before addition of water (50 g)to eliminate any unreacted hydride. Following workup as described inSynthesis Example 1, the reaction yielded a product mixture featuring amixture of (vinylbenzyl)-functionalized cyclopentadienes andallyl-functionalized cyclopentadienes connected by hexyl hydrocarbons.

Synthesis Example 9

Following the procedure in Example 1, NaH (2.2 eq) was combined withfreshly-cracked cyclopentadiene (1.0 eq) and a mixture of vinylbenzylchloride (1.0 eq) and allyl chloride (1.0 eq) to yield a product mixturefeaturing cyclopentadienes substituted with an average of onevinylbenzyl substituent and one allyl substituent.

Synthesis Example 10

Following a modified procedure, NaH (4.4 eq) was combined withfreshly-cracked cyclopentadiene (2.0 eq), and 1,6-dichlorohexane (1.0eq), followed by addition of allyl chloride (2.0 eq). After addition,the reaction was maintained at reflux for an additional 30 minutesbefore addition of water (50 g) to eliminate any unreacted hydride.Following workup as described in Synthesis Example 1, the reactionyielded a product mixture featuring allyl-functionalizedcyclopentadienes connected by hexyl hydrocarbons.

Synthesis Example 11

Following a modified procedure, NaH (5.5 eq) was combined withfreshly-cracked cyclopentadiene (2.0 eq), and 1,6-dichlorohexane (1.5eq), followed by addition of a mixture of vinylbenzyl chloride (1.0 eq)and allyl chloride (1.0 eq). After addition, the reaction was maintainedat reflux for an additional 30 minutes before addition of water (50 g)to eliminate any unreacted hydride. Following workup as described inSynthesis Example 1, the reaction yielded a product mixture featuringoligomers of (vinylbenzyl)-functionalized cyclopentadienes andallyl-functionalized cyclopentadienes connected by hexyl hydrocarbons.

Synthesis Example 12

13.5 g of resin from Example 1 was dissolved in 10.0 g ofdichloromethane solvent and combined with a solution of 1.5 g BMPI-300(Cyalume Specialty Products) in an additional 10.0 g of dichloromethanesolvent. The combined homogeneous solution was allowed to react at roomtemperature for 10 minutes, before removal of the dichloromethane byrotary evaporation at 50° C., yielding a product mixture featuringpartial reaction between the two resins.

Synthesis Example 13

11.25 g of resin from Example 1 was dissolved in 10.0 g ofdichloromethane solvent and combined with a solution of 3.75 g BMPI-300(Cyalume Specialty Products) in an additional 10.0 g of dichloromethanesolvent. The combined homogeneous solution was allowed to react at roomtemperature for 10 minutes, before removal of the dichloromethane byrotary evaporation at 50° C., yielding a product mixture featuringpartial reaction between the two resins.

Synthesis Example 14

7.5 g of resin from Example 1 was dissolved in 10.0 g of dichloromethanesolvent and combined with a solution of 7.5 g BMPI-300 (CyalumeSpecialty Products) in an additional 10.0 g of dichloromethane solvent.The combined homogeneous solution was allowed to react at roomtemperature for 10 minutes, before removal of the dichloromethane byrotary evaporation at 50° C., yielding a product mixture featuringpartial reaction between the two resins.

Synthesis Example 15

13.5 g of resin from Example 1 was dissolved in 10.0 g ofdichloromethane solvent and combined with a solution of 1.5 g maleicanhydride in an additional 10.0 g of dichloromethane solvent. Thecombined homogeneous solution was allowed to react at room temperaturefor 10 minutes, before removal of the dichloromethane by rotaryevaporation at 50° C., yielding a product mixture featuring partiallymaleated resins of Example 1.

Synthesis Example 16

11.25 g of resin from Example 1 was combined with a solution of 3.75 gBMI-3000 (Designer Molecules Inc.) in 15.0 g of dichloromethane solvent.The combined homogeneous solution was allowed to react at roomtemperature for 10 minutes, before removal of the dichloromethane byrotary evaporation at 50° C., yielding a product mixture featuringpartial reaction between the two resins.

Synthesis Example 17

11.25 g of resin from Example 1 was combined with a solution of 3.75 gBMI-TMH (Daiwakasei Industry Co.) in 15.0 g of dichloromethane solvent.The combined homogeneous solution was allowed to react at roomtemperature for 10 minutes, before removal of the dichloromethane byrotary evaporation at 50° C., yielding a product mixture featuringpartial reaction between the two resins.

Synthesis Example 18

11.25 g of resin from Example 1 was combined with a solution of 3.75 gBMI-2300 (Daiwakasei Industry Co.) in 15.0 g of dichloromethane solvent.The combined homogeneous solution was allowed to react at roomtemperature for 10 minutes, before removal of the dichloromethane byrotary evaporation at 50° C., yielding a product mixture featuringpartial reaction between the two resins.

Synthesis Example 19

11.25 g of resin from Example 1 was combined with a solution of 3.75 g4,4′-diphenylmethanebismaleimide (Chem-Impex International) in 15.0 g ofdichloromethane solvent. The combined homogeneous solution was allowedto react at room temperature for 10 minutes, before removal of thedichloromethane by rotary evaporation at 50° C., yielding a productmixture featuring partial reaction between the two resins.

Synthesis Example 20

11.25 g of resin from Example 1 was combined with a solution of 3.75 gHomide 250 bismaleimide resin (HOS-Technik) in 15.0 g of dichloromethanesolvent. The combined homogeneous solution was allowed to react at roomtemperature for 10 minutes, before removal of the dichloromethane byrotary evaporation at 50° C., yielding a product mixture featuringpartial reaction between the two resins.

Synthesis Example 21

11.25 g of resin from Example 1 was combined with a solution of 3.75 gCompimide 353A bismaleimide resin (Evonik) in 15.0 g of dichloromethanesolvent. The combined homogeneous solution was allowed to react at roomtemperature for 10 minutes, before removal of the dichloromethane byrotary evaporation at 50° C., yielding a product mixture featuringpartial reaction between the two resins.

Synthesis Example 22

11.25 g of resin from Example 1 was combined with a solution of 3.75 gCompimide C796 bismaleimide resin (Evonik) in 15.0 g of dichloromethanesolvent. The combined homogeneous solution was allowed to react at roomtemperature for 10 minutes, before removal of the dichloromethane byrotary evaporation at 50° C., yielding a product mixture featuringpartial reaction between the two resins.

Synthesis Example 23

11.25 g of resin from Example 8 was combined with a solution of 3.75 gBMPI-300 (Cyalume Specialty Products) in 15.0 g of dichloromethanesolvent. The combined homogeneous solution was allowed to react at roomtemperature for 10 minutes, before removal of the dichloromethane byrotary evaporation at 50° C., yielding a product mixture featuringpartial reaction between the two resins.

Synthesis Example 24

11.25 g of resin from Example 9 was combined with a solution of 3.75 gBMPI-300 (Cyalume Specialty Products) in 15.0 g of dichloromethanesolvent. The combined homogeneous solution was allowed to react at roomtemperature for 10 minutes, before removal of the dichloromethane byrotary evaporation at 50° C., yielding a product mixture featuringpartial reaction between the two resins.

Synthesis Example 25

11.25 g of resin from Example 1 was combined with a solution of 3.75 gBMI 689 (Designer Molecules Inc.) in 15.0 g of dichloromethane solvent.The combined homogeneous solution was allowed to react at roomtemperature for 10 minutes, before removal of the dichloromethane byrotary evaporation at 50° C., yielding a product mixture featuringpartial reaction between the two resins.

Synthesis Example 26

In a modified procedure, freshly-cracked cyclopentadiene (1.0 eq) wascombined with vinylbenzyl chloride (1.0 eq), methyl tributyl ammoniumchloride (0.05 eq), and 50 wt % KOH aqueous solution. The biphasicmixture was allowed to react under vigorous stirring for 4 hours at roomtemperature, after which the organic layer was separated from theaqueous base. The organic phase was diluted with a mix of xylenes andhexane (50 vol %) and washed several times with aqueous HCl (10 wt %)solution and water before isolation of the organic phase. The organicphase was dried over sodium sulfate and the solvents were removed byvacuum distillation, yielding a product mixture featuringcyclopentadienes substituted with one or more vinylbenzyl substituents.

POLYMERIZATION EXAMPLES Polymerization 1: Thermal Polymerization ofExample 1

10.0 g of resin from Example 1 was poured into a mold constructed ofglass plate and a 1.6 mm-thick PTFE spacer and cured by oven ramp from100-190° C. at a rate of 1° C./minute, followed by 1 hour of cure at190° C. to generate a cured resin panel. Dielectric properties: Dk 2.63,Df 0.0017

Polymerization 2: Radical Polymerization of Example 1

10.0 g of resin from Example 1 was combined with 0.75 wt % Trigonox145-E85 peroxide and cured in the same manner as PolymerizationExample 1. Dielectric properties: Dk 2.65, Df 0.0036

Polymerization 3: Thermal Polymerization of Example 2

10.0 g of resin from Example 2 was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.68, Df 0.0019

Polymerization 4: Thermal Polymerization of Example 3

10.0 g of resin from Example 3 was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.31, Df 0.0024

Polymerization 5: Radical Polymerization of Example 3

10.0 g of resin from Example 3 was combined with 1.50 wt % Trigonox145-E85 peroxide and cured in the same manner as PolymerizationExample 1. Dielectric properties: Dk 2.36, Df 0.0028

Polymerization 6: Thermal Polymerization of Blends of Examples 2 and 3

10.0 g of resin were formed by blending 5.0 g of resin from Example 3with 5.0 g of resin from Example 2. This blend was cured in the samemanner as Polymerization Example 1. Dielectric properties: Dk 2.61, Df0.0019

Polymerization 7: Thermal Polymerization of Example 4

10.0 g of resin from Example 4 was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.51, Df 0.011

Polymerization 8: Radical Polymerization of Example 4

10.0 g of resin from Example 4 was combined with 1.50 wt % Trigonox145-E85 peroxide and cured in the same manner as PolymerizationExample 1. Dielectric properties: Dk 2.53, Df 0.011

Polymerization 9: Thermal Polymerization of Example 6

10.0 g of resin from Example 6 was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.62, Df 0.0021

Polymerization 10: Thermal Polymerization of Example 7

10.0 g of resin from Example 7 was cured in the same manner asPolymerization Example 1.

Polymerization 11: Thermal Polymerization of Blends of Examples 1 and 6

10.0 g of resin were formed by blending 5.0 g of resin from Example 1with 5.0 g of resin from Example 6. This blend was cured in the samemanner as Polymerization Example 1. Dielectric properties: Dk 2.64, Df0.0018

Polymerization 12: Thermal Polymerization of Example 8

10.0 g of resin from Example 8 was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.53, Df 0.0018

Polymerization 13: Thermal Polymerization of Example 9

10.0 g of resin from Example 9 was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.62, Df 0.0015

Polymerization 14: Thermal Polymerization of Blends of Examples 1 and

10.0 g of resin were formed by blending 5.0 g of resin from Example 1with 5.0 g of resin from Example 10. This blend was cured in the samemanner as Polymerization Example 1. Dielectric properties: Dk 2.52, Df0.0022

Polymerization 15: Thermal Polymerization of Blends of Examples 6 and

10.0 g of resin were formed by blending 5.0 g of resin from Example 6with 5.0 g of resin from Example 10. This blend was cured in the samemanner as Polymerization Example 1. Dielectric properties: Dk 2.48, Df0.0026

Polymerization 16: Thermal Polymerization of Blend of Example 1 withHigh-Vinyl Cyanate Ester Resin

10.0 g of resin were formed by blending 9.0 g of resin from Example 1with 1.0 g of vinyl-functionalized cyanate ester resin HTL-300. Thisblend was cured in the same manner as Polymerization Example 1.Dielectric properties: Dk 2.65, Df 0.0028

Polymerization 17: Thermal Polymerization of Blend of Example 1 withCatalyzed High-Vinyl Cyanate Ester Resin

10.0 g of resin were formed by blending 9.0 g of resin from Example 1with 1.0 g of vinyl-functionalized cyanate ester resin HTL-300 that hadbeen catalyzed with Novocure 200. This blend was poured into a moldconstructed of glass plate and a 1.6 mm-thick PTFE spacer and cured byoven ramp from 75-190° C. at a rate of 1° C./minute, 1 hour of cure at190° C., secondary ramp of 190-230° C. at a rate of 1° C./min, 2 hoursof cure at 230° C., followed by oven ramp from 230-250° C. at a rate of1° C./min, with final post-cure at 250° C. for one hour to generate acured resin panel. Dielectric properties: Dk 2.67, Df 0.0034

Polymerization 18: Thermal Polymerization of Blend of Example 1 withCatalyzed High-Vinyl Cyanate Ester Resin

10.0 g of resin were formed by blending 5.0 g of resin from Example 1with 5.0 g of vinyl-functionalized cyanate ester resin HTL-300 that hadbeen catalyzed with Novocure 200. This blend was poured into a moldconstructed of glass plate and a 1.6 mm-thick PTFE spacer and cured byoven ramp from 75-190° C. at a rate of 1° C./minute, 1 hour of cure at190° C., secondary ramp of 190-230° C. at a rate of 1° C./min, 2 hoursof cure at 230° C., followed by oven ramp from 230-250° C. at a rate of1° C./min, with final post-cure at 250° C. for one hour to generate acured resin panel. Dielectric properties: Dk 2.80, Df 0.0085

Polymerization 19: Thermal Polymerization of Blend of Example 1 withCatalyzed High-Vinyl Cyanate Ester Resin

10.0 g of resin were formed by blending 0.54 g of resin from Example 1with 9.33 g of a cyanate ester containing olefinic groups (HTL-300) and0.13 g of Novocure 200. This blend was placed in an oven and thetemperature ramp 1° C./min from room temperature to 160° C. and held for1 hour at 160° C. after which the temperature was ramped at 1° C./min to190° C. and held for 2 hours at 190° C. Dielectric properties: Dk 2.82,Df 0.0051

Polymerization 20: Thermal Polymerization of Blend of Example 1 withCatalyzed High-Vinyl Cyanate Ester Resin

10.0 g of resin were formed by blending 2.00 g of resin from Example 1with 7.86 g of a cyanate ester containing olefinic groups (HTL-300) and0.14 g of Novocure 200. This blend was placed in an oven and thetemperature ramp 1° C./min from room temperature to 160° C. and held for1 hour at 160° C. after which the temperature was ramped at 1° C./min to190° C. and held for 2 hours at 190° C. Dielectric properties: Dk 2.81,Df 0.0054

Polymerization 21: Thermal Polymerization of Blend of Example 1 withCatalyzed High-Vinyl Cyanate Ester Resin

10.0 g of resin were formed by blending 2.99 g of resin from Example 1with 6.88 g of a cyanate ester containing olefinic groups (HTL-300) and0.13 g of Novocure 200. This blend was placed in an oven and thetemperature ramp 1° C./min from room temperature to 160° C. and held for1 hour at 160° C. after which the temperature was ramped at 1° C./min to190° C. and held for 2 hours at 190° C. Dielectric properties: Dk 2.79,Df 0.0057

Polymerization 22: Thermal Polymerization of Blend of Example 1 withHigh-Vinyl Polybutadiene Resin

10.0 g of resin were formed by blending 9.0 g of resin from Example 1with 1.0 g of vinyl-functionalized polybutadiene resin Ricon 153. Thisblend was cured in the same manner as Polymerization Example 1.Dielectric properties: Dk 2.53, Df 0.0014

Polymerization 23: Thermal Polymerization of Blend of Example 1 withHigh-Vinyl Polybutadiene Resin

10.0 g of resin were formed by blending 7.5 g of resin from Example 1with 2.5 g of vinyl-functionalized polybutadiene resin Ricon 153. Thisblend was cured in the same manner as Polymerization Example 1.Dielectric properties: Dk 2.48, Df 0.0018

Polymerization 24: Thermal Polymerization of Blend of Example 1 withButadiene-Styrene Copolymer Resin

10.0 g of resin were formed by blending 9.0 g of resin from Example 1with 1.0 g of vinyl-functionalized butadiene-styrene copolymer resinRicon 100. This blend was cured in the same manner as PolymerizationExample 1. Dielectric properties: Dk 2.60, Df 0.0014

Polymerization 25: Thermal Polymerization of Blend of Example 1 withHexanediol Diacrylate

10.0 g of resin were formed by blending 9.0 g of resin from Example 1with 1.0 g of hexanediol diacrylate Sartomer CN-301. This blend wascured in the same manner as Polymerization Example 1. Dielectricproperties: Dk 2.64, Df 0.0037

Polymerization 26: Thermal Polymerization of Blend of Example 1 withPolybutadiene Dimethacrylate

10.0 g of resin were formed by blending 9.0 g of resin from Example 1with 1.0 g of polybutadiene dimethacrylate Sartomer CN-303. This blendwas cured in the same manner as Polymerization Example 1. Dielectricproperties: Dk 2.64, Df 0.0028

Polymerization 27: Thermal Polymerization of Blend of Example 1 withPhosphazene

10.0 g of resin were formed by blending 7.5 g of resin from Example 1with 2.5 g of an olefin containing phosphazene (SPV-100). This blend wasplaced in an oven and the temperature ramp 1° C./min from roomtemperature to 160° C. and held for 1 hour at 160° C. after which thetemperature was ramped at 1° C./min to 190° C. and held for 2 hours at190° C. Dielectric properties: Dk 2.95, Df 0.0032

Polymerization 28: Thermal Polymerization of Blend of Example 1 withPhosphazene

10.0 g of resin were formed by blending 5.0 g of resin from Example 1with 5.0 g of an olefin containing phosphazene (SPV-100). This blend wasplaced in an oven and the temperature ramp 1° C./min from roomtemperature to 160° C. and held for 1 hour at 160° C. after which thetemperature was ramped at 1° C./min to 190° C. and held for 2 hours at190° C. Dielectric properties: Dk 2.92, Df 0.0058

Polymerization 29: Thermal Polymerization of Blend of Example 1 withHydroxylated Polybutadiene Acrylic Ester

10.0 g of resin were formed by blending 5.02 g of resin from Example 1with 4.98 g of hydroxylated polybutadiene Acrylic ester (HBAE). Thisblend was placed in an oven and the temperature ramp 1° C./min from roomtemperature to 160° C. and held for 1 hour at 160° C. after which thetemperature was ramped at 1° C./min to 190° C. and held for 2 hours at190° C. Dielectric properties: Dk 2.60, Df 0.0040

Polymerization 30: Thermal Polymerization of Blend of Example 1 withMethacryl-PPE

10.0 g of resin were formed by blending 5.15 g of resin from Example 1with 4.85 g of methacrylated polyphenylether resin (SA-9000) in 5 mL ofDCM. This blend was drawn into a thin layer on a glass sheet with a drawknife and the solvent allowed to evaporate. The thin layer wassandwiched between glass sheets and placed in an oven and thetemperature ramped 1° C./min from room temperature to 160° C. and heldfor 1 hour at 160° C. after which the temperature was ramped at 1°C./min to 190° C. and held for 2 hours at 190° C. Dielectric properties:Dk 1.71, Df 0.0036

Polymerization 31: Thermal Polymerization of Blend of Example 1 withEpoxies

10.0 g of resin were formed by blending 3.62 g of resin from Example 1with 1.97 g glycidyl methacrylate and 4.42 g of dicyclopentadiene-phenolepoxy This blend was placed in an oven and the temperature ramp 1°C./min from room temperature to 160° C. and held for 1 hour at 160° C.after which the temperature was ramped at 1° C./min to 190° C. and heldfor 2 hours at 190° C. Dielectric properties: Dk 3.0, Df 0.051

Polymerization 32: Thermal Polymerization of Blend of Example 1 withBismaleimide

10.0 g of resin were formed by blending 5.34 g of resin from Example 1with 4.66 g of bismaleimide resin (BMPI-300) in 5 mL of DCM. This blenddrawn into a thin layer on a glass sheet with a draw knife and thesolvent allowed to evaporate. The thin layer was sandwiched betweenglass sheets and placed in an oven and the temperature ramped 1° C./minfrom room temperature to 160° C. and held for 1 hour at 160° C. afterwhich the temperature was ramped at 1° C./min to 190° C. and held for 2hours at 190° C. Dielectric properties: Dk 2.53, Df 0.0023

Polymerization 33: Thermal Polymerization of Example 12

10.0 g of resin from Example 12 was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.68, Df 0.0012

Polymerization 34: Thermal Polymerization of Example 13

10.0 g of resin from Example 13 was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.70, Df 0.0017

Polymerization 35: Thermal Polymerization of Example 15

10.0 g of resin from Example 15 was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.79, Df 0.0055

Polymerization 36: Thermal Polymerization of Blend of Example 1 withDivinylbenzene

10.0 g of resin were formed by blending 9.5 g of resin from Example 1with 0.5 g of divinylbenzene (DVB). This blend was cured in the samemanner as Polymerization Example 1. Dielectric properties: Dk 2.64, Df0.0016

Polymerization 37: Thermal Polymerization of Blend of Example 1 withTriallylisocyanurate

10.0 g of resin were formed by blending 9.5 g of resin from Example 1with 0.5 g of triallylisocyanurate (Evonik TAICROS). This blend wascured in the same manner as Polymerization Example 1. Dielectricproperties: Dk 2.67, Df 0.0016

Polymerization 38: Thermal Polymerization of Blend of Example 1 withTriallylisocyanurate

10.0 g of resin were formed by blending 8.8 g of resin from Example 1with 1.2 g of triallylisocyanurate (Evonik TAICROS). This blend wascured in the same manner as Polymerization Example 1. Dielectricproperties: Dk 2.65, Df 0.0014

Polymerization 39: Thermal Polymerization of Blend of Example 1 withTriallylisocyanurate

10.0 g of resin were formed by blending 7.5 g of resin from Example 1with 2.5 g of triallylisocyanurate (Evonik TAICROS). This blend wascured in the same manner as Polymerization Example 1. Dielectricproperties: Dk 2.69, Df 0.0014

Polymerization 40: Thermal Polymerization of Blend of Example 1 withVinylsilane

10.0 g of resin were formed by blending 9.0 g of resin from Example 1with 1.0 g of triethoxyvinyl silane (Evonik Dynasylan VTEO). This blendwas cured in the same manner as Polymerization Example 1. Dielectricproperties: Dk 2.68, Df 0.0055

Polymerization 41: Thermal Polymerization of Blend of Example 1 withMethacrylsilane

10.0 g of resin were formed by blending 9.0 g of resin from Example 1with 1.0 g of 3-trimethoxysilylpropyl methacrylate (Evonik DynasylanMEMO). This blend was cured in the same manner as PolymerizationExample 1. Dielectric properties: Dk 2.74, Df 0.0058

Polymerization 42: Thermal Polymerization of Example 16

10.0 g of resin from Example 16 was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.64, Df 0.0012

Polymerization 43: Thermal Polymerization of Example 17

10.0 g of resin from Example 17 was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.73, Df 0.0028

Polymerization 44: Thermal Polymerization of Example 18

10.0 g of resin from Example 18 was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.25, Df 0.0025

Polymerization 45: Thermal Polymerization of Example 19

10.0 g of resin from Example 19 was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.33, Df 0.0028

Polymerization 46: Thermal Polymerization of Example 21

10.0 g of resin from Example 21 was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.81, Df 0.0031

Polymerization 47: Thermal Polymerization of Example 22

10.0 g of resin from Example 22 was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.62, Df 0.0040

Polymerization 48: Thermal Polymerization of Blend of Example 1 withBismaleimide

15.0 g of resin were formed by blending 11.25 g of resin from Example 1with 3.75 g of 4,4′-diphenylmethanebismaleimide (Chem-ImpexInternational). This blend was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.76, Df 0.0016

Polymerization 49: Thermal Polymerization of Example 24

10.0 g of resin from Example 24 was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.68, Df 0.0021

Polymerization 50: Thermal Polymerization of Example 25

10.0 g of resin from Example 23 was cured in the same manner asPolymerization Example 1. Dielectric properties: Dk 2.64, Df 0.0014

Polymerization 51: Thermal Polymerization of Blend of Example 8 withBismaleimide

10.0 g of resin were formed by blending 7.50 g of resin from Example 8with 2.50 g of BMPI-300 (Cyalume Specialty Products). This blend wascured in the same manner as Polymerization Example 1. Dielectricproperties: Dk 2.42, Df 0.0016

Polymerization 52: Thermal Polymerization of Blend of Example 10 withBismaleimide

10.0 g of resin were formed by blending 7.50 g of resin from Example 10with 2.50 g of BMPI-300 (Cyalume Specialty Products). This blend wascured in the same manner as Polymerization Example 1. Dielectricproperties: Dk 2.04, Df 0.0024

Additional Embodiments

1. A resin having a structure defined by Formula (VI):

wherein

X is cyclopentadiene;

B is H;

(Z)_(n) is a bond;

m is ranges from 1 to 5;

and A has the structure defined by Formula (IIC):

wherein R^(a) and R^(b) are independently selected from H, F, a C₁ toC₁₀ linear or cyclic, branched or straight chain aliphatic group; T is—CH₂—, -phenyl, or —CH₂-phenyl; Y is H, —CH₃, —CH═CH₂, —CH═CH—CH₃, oralkyne; t is 0 or an integer ranging from 1 to 20; u is 0 or 1; z is aninteger ranging from 1 to 5.

2. The resin of embodiment 1, wherein t is 1; and R^(a) and R^(b) areeach H.

3. The resin of embodiment 2, wherein Y is —CH═CH₂.

4. The resin of embodiment 1, wherein m is 2, and a first A groupcomprises a vinyl benzyl moiety; and wherein a second A group is—CH₂—CH═CH₂.

5. The resin of embodiment 1, wherein the resin has the structure

6. A resin having a structure defined by Formula (VII):

wherein

Z has the structure defined by Formula (IIIA):

wherein

R^(e) and R^(f) are independently selected from H, F, or a straightchain or branched alkyl group having between 1 and 6 carbon atoms; and

y is an integer ranging from between 1 and about 20;

m and s are independently an integer ranging from between 1 and about 5;

A is H or a moiety having a structure defined by Formula (IIC):

wherein R^(a) and R^(b) are independently selected from H, F, a C₁ toC₁₀ linear or cyclic, branched or straight chain aliphatic group;

T is —CH₂—, -phenyl, or —CH₂-phenyl;

Y is H, —CH₃, —CH═CH₂, —CH═CH—CH₃, or alkyne;

t is 0 or an integer ranging from 1 to 20;

u is 0 or 1; and

z is an integer ranging from 1 to 5.

7. The resin of embodiment 6, wherein n is 1, and R^(e) and R^(f) areeach H.

8. The resin of embodiment 6, wherein A is H.

9. The resin of embodiment 8, wherein y is 6.

10. The resin of embodiment 8, wherein y is 3.

11. The resin of embodiment 6, wherein the resin has the structureselected from the group consisting of:

12. The resin of embodiment 6, wherein at least one of (A)_(m) or(A)_(s) comprise a moiety having the structure defined by Formula (IIC):

and R^(a) and R^(b) are each H.

13. The resin of embodiment 12, wherein Y is —CH═CH₂.

14. The resin of embodiment 13, R^(e) and R^(f) are each H.

15. The resin of embodiment 14, wherein y is 6.

16. The resin of embodiment 14, wherein m is 1 and s is 0.

17. The resin of embodiment 12, wherein the resin has the structure:

18. The resin of embodiment 6, wherein (A)_(m) and (A)_(s) each comprisea different moiety having Formula (IIC):

19. The resin of embodiment 18, wherein for (A)_(m), t is 1 and T isphenyl; and for (A)_(s) t is 1 and u is 0.

20. The resin of embodiment 18, wherein for (A)_(m), t is 1; T isphenyl, and Y is —CH═CH₂; and for (A)_(s) t is 1, u is 0, and Y is—CH═CH₂.

21. The resin of embodiment 18, wherein the resin has the structure:

22. A resin having a structure defined by Formula (IVB):

wherein each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic group having between 1 and 40 carbon atoms;

Z is a straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms, or when n is 0, Zis a bond;

m is an integer ranging from 1 to 5;

n is 0 or 1;

p is 0 or an integer ranging from 1 to 150;

q is 0 or 1;

r is an integer ranging from 1 to 4;

s is an integer ranging from 1 to 5;

w is 0 or an integer ranging from 1 to 150; and

x is 0 or 1.

23. The resin of embodiment 22, wherein each of (A)_(m) and (A)_(s) aredifferent.

24. The resin of embodiment 23, wherein (A)_(m) comprises a vinyl benzylgroup; and wherein (A)_(s) is —CH₂—CH═CH₂.

25. The resin of embodiment 24, wherein (A)_(m) is —CH₂-phenyl-CH═CH₂.

26. The resin of embodiment 25, wherein (Z)_(n) is an unsubstitutedalkyl group having from 2 to 6 carbon atoms.

27. The resin of embodiment 22, wherein the resin has the structure:

28. A resin having the structure defined by Formula (XIIC) or (XIID):

wherein

Z has the structure defined by Formula (IIIA):

R^(e) and R^(f) are independently selected from H, F, or a straightchain or branched alkyl group having between 1 and 6 carbon atoms; and

y is an integer ranging from between 1 and about 20;

m and s are independently an integer ranging from between 1 and about 5;

A is H or a moiety having a structure defined by Formula (IIC):

wherein R^(a) and R^(b) are independently selected from H, F, a C₁ toC₁₀ linear or cyclic, branched or straight chain aliphatic group;

T is —CH₂—, -phenyl, or —CH₂-phenyl;

Y is H, —CH₃, —CH═CH₂, —CH═CH—CH₃, or alkyne;

m is an integer ranging from 1 to 5;

n is 0 or 1;

p is 0 or an integer ranging from 1 to 150;

r is an integer ranging from 1 to 4;

t is 0 or an integer ranging from 1 to 20;

u is 0 or 1; and

w is 0 or an integer ranging from 1 to 150;

x is 0 or 1,

z is an integer ranging from 1 to 5;

R¹³ is a saturated or unsaturated, straight-chain or branched, linear orcyclic, substituted or unsubstituted, aliphatic or aromatic group havingbetween 1 and 50 carbon atoms, and which may be substituted with one ormore heteroatoms selected from O, N, or S;

R¹⁴ is a saturated or unsaturated, straight-chain or branched, linear orcyclic, substituted or unsubstituted, aliphatic or aromatic group havingbetween 1 and 40 carbon atoms; —(R¹³)_(k)—R¹—, —R¹⁵—(R¹³)_(k)— or—R¹⁵—(R¹³)_(k)—R¹⁵—;

each R¹⁵ is independently a saturated or unsaturated, straight-chain orbranched, linear or cyclic, substituted or unsubstituted, aliphatic oraromatic group having between 1 and 40 carbon atoms; and

k is an integer ranging from 1 to 10.

29. A resin comprising the reaction product of (i) a compound selectedfrom the group consisting of:

where w and p are independently an integer ranging from 1 to 150;

and (ii) a dienophile, wherein the dienophile is selected from the groupconsisting of a bis-maleimide, a derivative of a bis-maleimide, a maleicanhydride, a derivative of a maleic anhydride, a benzoquinone, aderivative of a benzoquinone, an acrylate, and a bis-acrylate.

30. A composition comprising a first resin of embodiment 22 and a secondresin of embodiment 22, wherein each of the first and second resins aredifferent.

31. The composition of embodiment 30, wherein the first resin is presentin the composition in an amount ranging from between about 20% to about80% by weight of the composition.

32. The composition of embodiment 30, wherein the first resin is presentin the composition in an amount ranging from between about 30% to about65% by weight of the composition.

33. The composition of embodiment 30, further comprising at least athird resin of any of embodiments 1 to 13, wherein the third resin isdifferent than the first and second resins.

34. A polymer derived from a resin of embodiment 22.

35. The polymer of embodiment 34, wherein the resin comprises at leastone A moiety terminating in one of a —CH═CH₂ group, a —CH═CH—CH₃ group,or an alkyne group.

36. The polymer of embodiment 34, further comprising an additiveselected from the group consisting of adhesion agents,peroxides/crosslinking agents, antioxidants, flame retardants, diluentsand fillers.

37. A co-polymer comprising a first resin of embodiment 22 and a secondresin of embodiment 22, wherein the first and second resins aredifferent.

38. A co-polymer comprising a resin of any of embodiment 22, and asecond component that differs from the resin of embodiment 22, whereinthe second component is selected from the group consisting ofpolyethylenes, polypropylenes, polybutylenes, low vinyl polybutadienes(predominantly 1,3 addition), high vinyl polybutadienes (significant 1,2addition), polystyrenes, butadiene-styrene copolymers, SMA polymers, ABSpolymers, polydicyclopentadienes, epoxies, polyurethanes, cyanateesters, poly(phenylene oxide), EPDM polymers, cyclic olefin copolymers(COC), polyimides, bismaleimides, phosphazenes, olefin-modifiedphosphazenes, acrylates, vinyl esters, polylactones, polycarbonates,polysulfones, polythioethers, polyetheretherketones (PEEK),polydimethylsiloxanes (PDMS), polyethylene terephthalates (PET), andpolybutylene terephthalates (PBT), styrene, divinylbenzene,1,2-bis(vinylphenyl)ethane, vinylbenzyl ether compounds, vinyl ethercompounds, allyl ether compounds, vinylphenyl monomers, vinyl monomers,allyl monomers, or derivatives of such components.

39. A polymer or co-polymer comprising a resin of embodiment 22, whereinsaid polymer has a Dk value ranging from about 1.5 to about 3.

40. The polymer or co-polymer of embodiment 39, wherein the Dk valuesranges from about 2.0 to about 2.8.

41. The polymer or copolymer of embodiment 39, wherein the Dk value isless than 2.6.

42. The polymer or copolymer of embodiment 39, wherein the Dk value isless than 2.4.

43. A polymer or co-polymer comprising a resin of embodiment 22, whereinsaid polymer has a Df value ranging from about 0.0001 to 0.004.

44. The polymer or copolymer of embodiment 43, wherein the Df valueranges from about 0.0009 to about 0.003.

45. The polymer or copolymer of embodiment 43, wherein the Df value isless than about 0.002.

46. The polymer or copolymer of embodiment 43, wherein the Df value isless than about 0.001.

47. A resin of Formula (IA) or (IB):

wherein

X is a moiety comprising a cyclopentadiene-based ring;

B is H or X(A)_(s);

L is a leaving group.

each A is independently H, F, or a saturated or unsaturated,straight-chain or branched, linear or cyclic, substituted orunsubstituted, aliphatic or aromatic group having between 1 and 40carbon atoms, and which may optionally comprise one or more heteroatoms;

Z is a bond or straight-chain or branched, substituted or unsubstituted,aliphatic group having between 1 and 20 carbon atoms;

m is an integer ranging from 1 to 5;

n is 0 or 1;

o is 0 or 1;

p is 0 or an integer ranging from 1 to 150;

q is 0 or 1;

r is an integer ranging from 1 to 4;

s is an integer ranging from 1 to 5;

w is 0 or an integer ranging from 1 to 150;

x is 0 or 1.

48. The resin of embodiment 47, wherein the resin has the structuredefined by any of Formulas (IVA), (IVB), and (IVC),

49. The resin of any of embodiments 47-48, wherein A has the structuredefined by Formula (IIA):

wherein R¹ is a bond, or a saturated or unsaturated straight-chain orbranched, linear or cyclic, substituted or unsubstituted, aliphatic oraromatic group having from about 1 to about 10 carbon atoms,

Q is a bond or a linking group optionally comprising a heteroatom;

T is a bond or —CH₂—, -phenyl, or —CH₂-phenyl;

Y is H, —CH₃, —CH═CH₂, —CH═CH—CH₃, or an alkyne group;

t and v are independently 0 or an integer ranging from 1 to 20;

u is 0 or 1; and

z is an integer ranging from 1 to 5.

50. The resin of any of embodiments 47-49, wherein A has the structuredefined by Formula (IIB):

wherein

Q is C, O, N, or S;

R^(a), R^(b), R^(c), R^(d) are independently selected from H, F, a C₁ toC₁₀ linear or cyclic, saturated or unsaturated, branched or straightchain aromatic or aliphatic group;

T is —CH₂—, -phenyl, or —CH₂-phenyl;

Y is H, —CH₃, —CH═CH₂, —CH═CH—CH₃, or an alkyne group;

t and v are independently 0 or an integer ranging from 1 to 20;

u is 0 or 1; and

z is an integer ranging from 1 to 5.

51. The resin of any of embodiments 47-50 wherein when T is -phenyl, or—CH₂— phenyl, and Y is —CH═CH₂, —CH═CH—CH₃, or an alkyne group, z is 1.

52. The resin of any of embodiments any of embodiments 47-51, wherein aDk value ranges from about 1.5 to about 3.

53. The resin of any of embodiments any of embodiments 47-51, wherein aDf value ranges from about 0.0001 to about 0.004

54. The resin of any of embodiments 47-53, wherein the resin is suitablefor incorporation into a printed circuit board.

55. A resin having the structure:

56. A resin having the structure:

57. A resin having the structure:

58. A resin having the structure:

59. A resin having the structure:

60. A resin having the structure:

where w and p are independently 0 or an integer ranging from 1 to 150.

61. The resin of embodiment 60, wherein w and p are independently 0 oran integer ranging from 1 to 100.

62. The resin of embodiment 60, wherein w and p are independently 0 oran integer ranging from 1 to 50.

63. A resin having the structure:

64. A resin having the structure:

65. A resin having the structure:

66. A resin having the structure:

67. A resin having the structure:

68. A resin having the structure:

wherein each w is independently 0 or an integer ranging from 1 to 150.

69. A composition comprising a mixture of two different resins of any ofembodiments 1-29 and 47-68.

70. The composition of embodiment 69, wherein a ratio of a first resinof any of embodiments 1-29 and 47-68 to a second resin of any ofembodiments 1-29 and 47-68 ranges from about 10:90 to about 25:75.

71. The composition of any of embodiments 69-70, wherein the compositioncomprises a third resin of any of embodiments 1-29 and 47-68, whereinthe third resin is different than either of the first or second resins.

72. The composition of any of embodiments 69-71, wherein the compositionfurther comprises a polymer or copolymer having a structure whichdifferences from the resins of any of embodiments 1-29 and 47-68.

73. The composition of any of embodiments 69-71, wherein the compositionfurther comprises at least one polymer selected from the groupconsisting of polyethylenes, polypropylenes, polybutylenes, low vinylpolybutadienes, high vinyl polybutadienes, polystyrenes,butadiene-styrene copolymers, SMA polymers, ABS polymers,polydicyclopentadienes, epoxies, polyurethanes, cyanate esters,poly(phenylene oxide), EPDM polymers, cyclic olefin copolymers,polyimides, bismaleimides, phosphazenes, olefin-modified phosphazenes,acrylates, vinyl esters, polylactones, polycarbonates, polysulfones,polythioethers, polyetheretherketones, polydimethylsiloxanes,polyethylene terephthalates, and polybutylene terephthalates.

74. A polymer comprising two different resins of any of embodiments 1-29and 47-68.

75. A blend comprising the polymer of embodiment 74, and a polymer orcopolymer having a structure which differences from the resins of any ofembodiments 1-29 and 47-68.

76. The blend of embodiment 75, wherein the polymer or copolymer isselected from the group consisting of polyethylenes, polypropylenes,polybutylenes, low vinyl polybutadienes, high vinyl polybutadienes,polystyrenes, butadiene-styrene copolymers, SMA polymers, ABS polymers,polydicyclopentadienes, epoxies, polyurethanes, cyanate esters,poly(phenylene oxide), EPDM polymers, cyclic olefin copolymers,polyimides, bismaleimides, phosphazenes, olefin-modified phosphazenes,acrylates, vinyl esters, polylactones, polycarbonates, polysulfones,polythioethers, polyetheretherketones, polydimethylsiloxanes,polyethylene terephthalates, and polybutylene terephthalates.

77. A product formed by reacting a resin of any of embodiments 1-29 and47-68 with a dienophile.

78. The product of embodiment 77, wherein the dienophile comprises anitroso group, a carbonyl group, or an imido group.

79. The product of embodiment 77, wherein the dienophile is an alkene.

80. The product of embodiment 79, wherein the alkene is an acrylate or abis-acrylate.

81. The product of embodiment 77, wherein the dienophile is selectedfrom the group consisting of methyl acrylate, ethyl acrylate, methylmethacrylate, ethyl methacrylate, vinyl acrylate, dimethyl fumarate,dimethyl maleate, diethyl fumarate, diethyl maleate, diphenyl fumarate,divinyl fumarate, divinylmaleate, acrolein, methyl vinyl ketone,divinylketone, acrylamide, N,N-dimethyl acrylamide, N,N-dimethylmethacrylamide, N,N-diethyl acrylamide, N,N-diethyl acrylamide,acrylonitrile, methacrylonitrile, 1,1-dicyanoethylene, maleonitrile,fiumaronitrile, and tetracyanoethylene.

82. The product of embodiment 77, wherein the dienophile is abis-maleimide.

83. The product of embodiment 82, wherein the bis-maleimide has astructure selected from the group consisting of:

wherein each R is independently selected from hydrogen, an aryl group, asubstituted aryl group, an aliphatic group, a substituted aliphaticgroup, a cyclic aliphatic group, and a substituted cyclic aliphaticgroup.

84. The product of embodiment 82, wherein the bis-maleimide is selectedfrom the group consisting of 1,6′-bismaleimide-(2,2,4-trimethyl)hexane,4,4′-Diphenylmethanebismaleimide, Polyphenylmethanebismaleimide,N,N′-(4-methyl-m-phenylene)-bismaleimide, N,N′-m-phenylenebismaleimide,bisphenol A diphenyl ether bismaleimide,3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide,N,N′-[Methylenebis(2,6-diethyl-4,1-phenylene)]bis(maleimide,N,N′-[Methylenebis(2-isopropyl-6-methyl-4,1-phenylene)]bis(maleimide),1,2-bis(maleimido)ethane, 1,4-bis(maleimido)butane, and1,6-bis(maleimido)hexane.

85. The product of embodiment 77, wherein the dienophile is selectedfrom the group consisting of maleic anhydride, derivatives of maleicanhydride, benzoquinone, and derivatives of benzoquinone.

86. The product of embodiment 77, wherein the dienophile is selectedfrom the group consisting of 1,4-benzoquinone, 2-methylbenzoquinone,2,3-dimethylbenzoquinone, 2,5-dimethylbenzoquinone,2,6-dimethylbenzoquinone, 2,3,5-trimethylbenzoquinone,2,3,5,6-tetramethylbenzoquinone, maleic anhydride, methyl maleicanhydride, dimethyl maleic anhydride, maleimide, N-methyl maleimide,N-ethyl maleimide, methyl maleimide, dimethyl maleimide, methyl-N-methylmaleimide, and dimethyl-N-methyl maleimide.

87. A substrate comprising a resin of any of embodiments 1-29 and 47-68;a product of any of embodiments 77-86; a blend of any of embodiments75-76; a polymer of any of embodiment 34-46 and 74; or a composition ofany of embodiments 30-33 and 69-73.

88. The substrate of embodiment 87, wherein the substrate is a packagingfor an integrated circuit.

89. The substrate of embodiment 88, wherein the packaging is a flipchip.

90. A laminate comprising a resin of any of embodiments 1-29 and 47-68;a product of any of embodiments 77-86; a blend of any of embodiments75-76; a polymer of any of embodiment 34-46 and 74; or a composition ofany of embodiments 30-33 and 69-73.

91. A film comprising a resin of any of embodiments 1-29 and 47-68; aproduct of any of embodiments 77-86; a blend of any of embodiments75-76; a polymer of any of embodiment 34-46 and 74; or a composition ofany of embodiments 30-33 and 69-73.

92. A film deposited on a substrate, the film comprising a resin of anyof embodiments 1-29 and 47-68; a product of any of embodiments 77-86; ablend of any of embodiments 75-76; a polymer of any of embodiment 34-46and 74; or a composition of any of embodiments 30-33 and 69-73.

93. The film deposited on a substrate of embodiment 92, wherein thesubstrate is selected from the group consisting of a polymeric material,a metal, a composite, glass, and any combination thereof.

94. A prepreg comprising a resin of any of embodiments 1-29 and 47-68; aproduct of any of embodiments 77-86; a blend of any of embodiments75-76; a polymer of any of embodiment 34-46 and 74; or a composition ofany of embodiments 30-33 and 69-73.

95. The prepreg of embodiment 95, further comprising at least one ofwoven glass, carbon, Kevlar, spectra, aramid, or quartz fibers.

96. A laminate comprising the prepreg of any of embodiments 94 and 95.

97. The laminate of embodiment 96, wherein the laminate has a glasstransition temperature of greater than 150° C.

98. A printed circuit board comprising a resin of any of embodiments1-29 and 47-68; a product of any of embodiments 77-86; a blend of any ofembodiments 75-76; a polymer of any of embodiment 34-46 and 74; or acomposition of any of embodiments 30-33 and 69-73.

99. The printed circuit board of embodiment 98, wherein the printedcircuit board is comprised of a multi-layer laminate.

100. The printed circuit board of any of embodiments 98-99, wherein theprinted circuit board is rigid.

101. The printed circuit board of any of embodiments 98-99, wherein theprinted circuit board is flexible.

102. An electronic device comprising the printed circuit board of any ofembodiments 98-101.

103. The electronic device of embodiment 103, wherein the electronicdevice is an internet-of-things base station.

104. A radome comprising a resin of any of embodiments 1-29 and 47-68; aproduct of any of embodiments 77-86; a blend of any of embodiments75-76; a polymer of any of embodiment 34-46 and 74; or a composition ofany of embodiments 30-33 and 69-73.

105. A radar structure or array comprising a resin of any of embodiments1-29 and 47-68; a product of any of embodiments 77-86; a blend of any ofembodiments 75-76; a polymer of any of embodiment 34-46 and 74; or acomposition of any of embodiments 30-33 and 69-73.

106. An antenna comprising a resin of any of embodiments 1-29 and 47-68;a product of any of embodiments 77-86; a blend of any of embodiments75-76; a polymer of any of embodiment 34-46 and 74; or a composition ofany of embodiments 30-33 and 69-73.

107. The antenna of embodiment 106, wherein the antenna is a cellularphone antenna.

108. The antenna of embodiment 106, wherein the antenna is a satellitephone antenna.

109. An under fill adhesive composition comprising a resin of any ofembodiments 1-29 and 47-68; a product of any of embodiments 77-86; ablend of any of embodiments 75-76; a polymer of any of embodiment 34-46and 74; or a composition of any of embodiments 30-33 and 69-73.

110. A composition comprising a resin of any of embodiments 1-29 and47-68 and a solvent.

111. The composition of embodiment 110, wherein the solvent is selectedfrom the group consisting of dichloromethane, THF, and xylene, toluene,methyl ethyl ketone, acetone, methyl acetate, butyl acetate, methanol,ethanol, isopropanol, glycol ether PM, glycol ether EB, methyl isobutylketone, and methyl amyl ketone.

112. The composition of embodiment 111, wherein an amount of solventwithin the composition ranges from about 1% to about 90% by total weightof the composition.

113. A kit comprising a first a composition of any of embodiments110-112, and a second composition of any of embodiments 110-112, whereinthe first composition and second composition comprise a different resin.

114. A kit comprising a composition of any of embodiments 110-112, and adienophile.

115. The kit of embodiment 114, wherein the dienophile is abis-maleimide.

116. The kit of embodiment 115, wherein the bis-maleimide has astructure selected from the group consisting of:

wherein each R is independently selected from hydrogen, an aryl group, asubstituted aryl group, an aliphatic group, a substituted aliphaticgroup, a cyclic aliphatic group, and a substituted cyclic aliphaticgroup.

117. The kit of embodiment 115, wherein the bis-maleimide is selectedfrom the group consisting of 1,6′-bismaleimide-(2,2,4-trimethyl)hexane,4,4′-Diphenylmethanebismaleimide, Polyphenylmethanebismaleimide,N,N′-(4-methyl-m-phenylene)-bismaleimide, N,N′-m-phenylenebismaleimide,bisphenol A diphenyl ether bismaleimide,3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide,N,N′-[Methylenebis(2,6-diethyl-4,1-phenylene)]bis(maleimide,N,N′-[Methylenebis(2-isopropyl-6-methyl-4,1-phenylene)]bis(maleimide),1,2-bis(maleimido)ethane, 1,4-bis(maleimido)butane, and1,6-bis(maleimido)hexane, and bis-maleimides derived from dimer acids.

118. A kit comprising a composition of any of embodiments 110-112, and acrosslinking agent.

119. The kit of embodiment 118, wherein the crosslinking agent isselected from the group consisting of triallyl cyanurate, triallylisocyanurate, polybutadiene dimethacrylates, polybutadiene diacrylates,divinylbenzene, 1,2-bis(vinylphenyl)ethane, vinylbenzyl ether compounds,vinyl ether compounds, allyl ether compounds, vinylphenyl monomers,vinyl monomers, and allyl monomers.

120. A kit comprising a composition of any of embodiments 110-112, and afiller.

All of the U.S. patents, U.S. patent application publications, U.S.patent applications, foreign patents, foreign patent applications andnon-patent publications referred to in this specification and/or listedin the Application Data Sheet are incorporated herein by reference, intheir entirety. Aspects of the embodiments can be modified, if necessaryto employ concepts of the various patents, applications and publicationsto provide yet further embodiments.

Although the disclosure herein has been described with reference toparticular embodiments, it is to be understood that these embodimentsare merely illustrative of the principles and applications of thepresent disclosure. It is therefore understood that numerousmodifications may be made to the illustrative embodiments and that otherarrangements may be devised without departing from the spirit and scopeof the present disclosure as defined by the appended claims.

All of the U.S. patents, U.S. patent application publications, U.S.patent applications, foreign patents, foreign patent applications andnon-patent publications referred to in this specification and/or listedin the Application Data Sheet are incorporated herein by reference, intheir entirety. Aspects of the embodiments can be modified, if necessaryto employ concepts of the various patents, applications and publicationsto provide yet further embodiments.

Although the disclosure herein has been described with reference toparticular embodiments, it is to be understood that these embodimentsare merely illustrative of the principles and applications of thepresent disclosure. It is therefore understood that numerousmodifications may be made to the illustrative embodiments and that otherarrangements may be devised without departing from the spirit and scopeof the present disclosure as defined by the appended claims.

1. A resin having a structure defined by Formula (VI):

wherein X is cyclopentadiene; B is H; (Z)_(n) is a bond; m is an integerranging from 1 to 5; and A has the structure defined by Formula (IIC):

wherein R^(a) and R^(b) are independently selected from H, F, a C₁ toC₁₀ linear or cyclic, branched or straight chain aliphatic group; T is—CH₂—, -phenyl, or —CH₂— phenyl; Y is H, —CH₃, —CH═CH₂, —CH═CH—CH₃, oralkyne; t is 0 or an integer ranging from 1 to 20; u is 0 or 1; z is aninteger ranging from 1 to
 5. 2. The resin of claim 1, wherein t is 1;and R^(a) and R^(b) are each H.
 3. The resin of claim 2, wherein Y is—CH═CH₂.
 4. The resin of claim 1, wherein m is 2, and a first A groupcomprises a vinyl benzyl moiety; and wherein a second A group is—CH₂—CH═CH₂.
 5. The resin of claim 1, wherein the resin has thestructure


6. The resin of claim 1, wherein the resin has the structure


7. The resin of claim 1, wherein the resin comprises at least one Amoiety terminating in one of a —CH═CH₂ group, a —CH═CH—CH₃ group, or analkyne group.
 8. A polymer or copolymer derived from the resin ofclaim
 1. 9. The polymer or copolymer of claim 8, wherein the polymer orcopolymer has a room temperature viscosity of 100 to 1,000,000 mPa*s.10. The polymer or copolymer of claim 8, wherein the polymer orcopolymer comprises a glassy material which can be ground into a finepowder.
 11. The polymer or copolymer of claim 8, wherein the polymer orcopolymer is soluble in an organic solvent selected from the groupconsist of MEK, Xylenes, NMP, DMF, DCM, Acetonitrile, Acetone, DMSO,THF.
 12. The polymer or copolymer of claim 8, wherein the polymer orcopolymer comprises a molecular weight ranging from between about 200 toabout 1,000,000 Da.
 13. The polymer or copolymer of claim 8, furthercomprising an additive selected from the group consisting of adhesionagents, peroxides, crosslinking agents, antioxidants, flame retardants,diluents and fillers.
 14. The polymer or copolymer of claim 8, whereinthe polymer or copolymer has a Dk value ranging from about 1.5 to about3.
 15. The polymer or copolymer of claim 8, wherein the polymer orcopolymer polymer has a Df value ranging from about 0.0001 to 0.004. 16.A polymer or copolymer comprising (i) a resin of claim 1; and (ii) asecond component selected from the group consisting of polyethylenes,polypropylenes, polybutylenes, low vinyl polybutadienes (predominantly1,3 addition), high vinyl polybutadienes (significant 1,2 addition),polystyrenes, butadiene-styrene copolymers, SMA polymers, ABS polymers,polydicyclopentadienes, epoxies, polyurethanes, cyanate esters,poly(phenylene oxide), EPDM polymers, cyclic olefin copolymers (COC),polyimides, bismaleimides, phosphazenes, olefin-modified phosphazenes,acrylates, vinyl esters, polylactones, polycarbonates, polysulfones,polythioethers, polyetheretherketones (PEEK), polydimethylsiloxanes(PDMS), polyethylene terephthalates (PET), and polybutyleneterephthalates (PBT), styrene, divinylbenzene,1,2-bis(vinylphenyl)ethane, vinylbenzyl ether compounds, vinyl ethercompounds, allyl ether compounds, vinylphenyl monomers, vinyl monomers,and allyl monomers.
 17. A copolymer derived from a polymerization of theresin of claim 1, and a comonomer, wherein the comonomer is selectedfrom the group consisting of styrene, divinyl benzene, vinyl toluene,methyl styrene, tert-butyl styrene, alpha-methyl styrene, alpha-methylstyrene dimer, vinyl cyclohexene, ethylidene norbornene, vinylnorbornene, alpha-pinene, beta-pinene, limonene, other terpenes,polybutadienes, modified polybutadienes, polystyrenes (homopolymer andblock-copolymers), modified polystyrenes, polyterpenes, othervinyl-reactive monomers, and reactivedimers/oligomers/polymers/co-polymers thereof.
 18. A compositioncomprising a first resin of claim 1 and a second resin of claim 1,wherein the first and second resins are different.
 19. A flexibleprinted circuit board comprising a material derived from the resin ofclaim
 1. 20. A radome or satellite structure comprising a materialderived from the resin of claim
 1. 21. A resin of claim 8 for use in anyone of: (i) a Copper clad laminate (CCL), (ii) a HDI substrate, (iii) anIC substrate in printed circuit boards at high temperature and low Dfapplications; (iv) a molding compound in power device application; and(v) RF heating in oil and gas applications.